Ceramic Insert Circuit Carrier Plate Soldering Without Copper Oxidation
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Solution Overview
Problem
Current methods for producing circuit boards face challenges in creating reliable soldered connections between ceramic inserts and metal carrier plates, particularly in achieving strong mechanical and electrical bonds while preventing oxidation of copper surfaces.
Innovation Solution
A method involving a carrier plate with recesses or elevations, where soldering material is arranged and energy is supplied using techniques like laser soldering, thermode soldering, or ultrasonic soldering to create a soldered connection, often with mechanical oscillation and preheating, allowing for efficient bonding of ceramic inserts to metal carrier plates and printed circuit boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional soldering methods are used to create soldered connections between ceramic inserts and metal carrier plates, then the bonding process can be performed, but copper oxidation occurs and connection reliability is compromised
Solution Approach 1:
The patent applies inert atmosphere protection by conducting the soldering process in an environment protected from oxidation. The soldering station is equipped with a protective cover that creates an inert atmosphere (typically using nitrogen or other inert gases) to prevent copper oxidation during the soldering process, thereby ensuring connection reliability without harmful oxidative effects.
2Strength
If mechanical pressure and energy are applied to produce soldered connections, then strong mechanical bonds are achieved, but the process complexity increases
Solution Approach 1:
The patent merges multiple functions into a single integrated soldering station device. The device combines mechanical pressure application, heating elements for energy supply, inert atmosphere protection, and positioning mechanisms all within one unified system. This integration achieves strong mechanical bonds through coordinated pressure and heat while managing overall process complexity through consolidation rather than separate independent systems.
Solution Approach 2:
The soldering station is designed as a multi-functional device that can perform various soldering operations (different materials, different connection types) using the same basic mechanism. The device accommodates different ceramic inserts, metal carrier plates, and soldering configurations through adjustable fixtures and universal heating/pressing mechanisms, reducing the need for multiple specialized devices.
3Manufacturing precision
If precise positioning of ceramic inserts in recesses is implemented, then connection precision is improved, but manufacturing complexity increases
Solution Approach 1:
The patent implements preliminary action by pre-forming precise recesses in the metal carrier plates during the carrier plate manufacturing process. These recesses are designed with precise dimensions and positions to accommodate specific ceramic inserts. The preliminary preparation of the carrier plate structure eliminates the need for complex real-time positioning mechanisms during assembly, as the recesses themselves provide the positioning function.
Solution Approach 2:
The recesses in the carrier plates serve as intermediary structures that mediate between the ceramic inserts and the final assembled connection. These recesses provide mechanical support, positioning, and alignment for the ceramic inserts, simplifying the overall positioning system by using the carrier plate structure itself as the positioning mechanism rather than requiring separate complex positioning devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables robust soldered connections that prevent copper oxidation, ensuring reliable mechanical and electrical connections, suitable for applications like LED modules in motor vehicle headlamps, with the ability to automate the process using suitable devices.
Implementation Method 1
supplying energy, in particular over a large area, to produce a soldered connection by means of a laser
Implementation Method 2
energy is supplied to produce a soldered connection by means of a thermode soldering method
Implementation Method 3
a step for preheating, in particular inductive preheating, of the carrier plate
Implementation Method 4
the supply of energy and/or the soldering material takes place by means of an ultrasonic soldering bath
Implementation Method 5
both with the supply of energy and soldering material and with mechanical friction
Implementation Method 6
the capillary effect advantageously being able to be used. The capillary effect ensures that the solder material 36 penetrates into the lateral gaps 44
Data Source
Figure 1
Figure 2~3
Figure 4
AI summary
Method (100) for manufacturing a circuit carrier board (10), comprising the following steps: providing (110) a carrier board (12) made of aluminum or an aluminum alloy, having a recess (14) and/or at least one protrusion; arranging (120) solder material (36) in the recess (14) and/or on the at least one protrusion; arranging (130) an insert (16) comprising at least one ceramic material in the recess (14) of the carrier board (12); providing (140) a contact force acting on the insert (12) in the direction of a base surface (40) of the recess (14) and/or, in particular perpendicularly, in the direction of the at least one protrusion; and supplying (150) energy to produce a solder joint. Figure 2