Ceramic Inspection Wiring Board via-Conductor Land Design
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Solution Overview
Problem
Conventional electronic component-inspection wiring boards with organic insulating layers lack sufficient rigidity, leading to positional misalignment issues when trying to achieve a higher conductor density, which hinders accurate inspection information collection from microelectronic components.
Innovation Solution
The use of ceramic layers with a higher wiring layer density per unit volume, where via-conductors pass through multiple ceramic layers, and large diameter lands are employed to ensure reliable connectivity and maintain electric continuity between the layers, allowing for accurate inspection information collection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If organic insulating layers are used in the wiring board, then ease of manufacture is improved, but rigidity deteriorates leading to insufficient structural stability
Solution Approach 1:
The patent changes the material parameter from organic insulating layers to ceramic layers, fundamentally altering the physical and mechanical properties of the wiring board. This material substitution transforms the rigidity parameter while maintaining manufacturability through established ceramic lamination and co-firing processes.
Solution Approach 2:
The patent employs composite material construction by combining multiple ceramic layers with metallic wiring layers and via-conductors. This composite structure achieves enhanced rigidity while integrating conductive elements, solving both the mechanical strength requirement and the electrical functionality requirement simultaneously.
2Strength
If ceramic layers replace organic layers to improve rigidity, then rigidity is improved, but manufacturing precision deteriorates due to shrinkage ratio differences between laminates
Solution Approach 1:
The patent applies local quality by introducing intermediate layers with specific properties at the interface between first and second ceramic laminates. These intermediate layers have different shrinkage characteristics that locally compensate for the shrinkage ratio differences between the ceramic laminates, thereby maintaining overall positioning accuracy.
Solution Approach 2:
The patent introduces intermediate layers as mediators between the first and second ceramic laminates. These intermediate layers buffer the shrinkage ratio differences, allowing the ceramic laminates to be co-fired while maintaining precise alignment of pads and via-conductors across the interface.
3Productivity
If higher conductor density is required in the first ceramic laminate, then productivity is improved through better signal transmission, but manufacturing precision deteriorates due to alignment difficulty between laminates
Solution Approach 1:
The patent applies preliminary action by pre-positioning pads and via-conductors on the first ceramic laminate before co-firing with the second laminate. The intermediate layers are designed in advance to accommodate and compensate for shrinkage, ensuring that high conductor density can be achieved without sacrificing alignment accuracy during the subsequent firing process.
4Device complexity
If co-firing of first and second ceramic laminates is performed, then device complexity is reduced through integration, but manufacturing precision deteriorates due to positional deviation of pads and via-conductors
Solution Approach 1:
The patent uses intermediate layers as mediators during the co-firing process. These intermediate layers are specifically designed to have shrinkage properties that compensate for the differential shrinkage between the first and second ceramic laminates, thereby maintaining positional accuracy of pads and via-conductors while enabling integrated co-firing.
Solution Approach 2:
The patent changes the shrinkage parameter of the intermediate layers to match or compensate for the shrinkage characteristics of the adjacent ceramic laminates. This parameter optimization allows the co-firing process to proceed while maintaining precise alignment, thus achieving both integration and manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the secure transmission of inspection signals to electronic components and accurate data collection, while accommodating varying shrinkage ratios between ceramic laminates, thus improving the rigidity and reliability of the inspection process.
Implementation Method 1
via-conductors pass through the plural ceramic layers, which wiring board is capable of reliably securing conductivity across the first and second ceramic laminates, maintaining the electric continuity of the wiring layer
Data Source
AI summary
An electronic component-inspection wiring board including a first laminate composed of plural first ceramic layers and having pads formed on a front surface to transmit inspection signals to an electronic component, wiring layers formed between the first ceramic layers , and via-conductors connecting pads to the wiring layers exposed on a rear surface of the first laminate; and a second laminate composed of second ceramic layers having plural via-conductors extending between front surface and rear surface of the second laminate, wherein lands connecting a via-conductor exposed on the rear surface of the first laminate and a via-conductor exposed on the front surface of the second laminate are disposed between the first laminate and the second laminate, and the diameter d1 of the land is 2-5 times larger than the diameter d2 of a via-conductor connected to the land.