Laminated Ceramic Component Insulator Thickness Control
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Solution Overview
Problem
Conventional methods for manufacturing laminated ceramic electronic components face challenges in achieving consistent insulator section thickness on the side surfaces of laminate chips, leading to reduced capacitance and structural defects due to variations in electrode height and positional inaccuracies during the stacking and cutting processes.
Innovation Solution
A method involving the application of a ceramic paste with specific viscosity (500 Pa·s to 2500 Pa·s) and inorganic solid content, applied using a grooved metal plate to ensure uniform thickness and prevent abnormal shape formation, along with a solvent immiscible with the binder component to maintain electrical stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If insulator sections are provided on side surfaces to ensure positioning accuracy, then manufacturing reliability is improved, but the size of the laminate chip increases and capacitance decreases
Solution Approach 1:
The invention changes the physical parameters of the paste material by controlling viscosity within 500-2500 Pa·s and adjusting inorganic solid content to satisfy C≧(S×t/(V/2))×100, enabling the paste to flow into grooves and form insulator sections of precise thickness without increasing chip size
Solution Approach 2:
The invention applies insulator sections only where needed on the side surfaces of the laminate chip through grooved metal plate molding, providing localized insulation and positioning accuracy without adding insulator material to the entire chip structure
2Area of moving object
If internal electrodes are printed in a matrix pattern, then electrode area is maximized, but positional accuracy in stacking decreases leading to structural defects
Solution Approach 1:
The invention introduces insulator sections as intermediary elements between the internal electrodes and the external environment, providing mechanical support and positioning reference that improves stacking accuracy while maintaining the matrix electrode pattern
3Ease of operation
If paste viscosity is low for smooth application, then ease of operation is improved, but applied thickness is reduced below required level
Solution Approach 1:
The invention optimizes the viscosity parameter to within 500-2500 Pa·s, finding the optimal balance where the paste is viscous enough to maintain thickness but fluid enough to flow into grooves smoothly during the molding process
Solution Approach 2:
The grooved metal plate is prepared in advance with grooves of specific volume, and the paste is applied before the molding action, allowing the paste to be distributed evenly into the grooves where it will form insulator sections of precise thickness
4Manufacturing precision
If inorganic solid content in paste is increased to ensure insulator thickness, then manufacturing precision is improved, but paste viscosity increases making application difficult
Solution Approach 1:
The invention simultaneously optimizes two parameters: inorganic solid content to ensure sufficient insulator thickness and viscosity to 500-2500 Pa·s to maintain workability, achieving a balance between precision and ease of operation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in laminated ceramic electronic components with stable electrical properties and improved appearance quality by ensuring consistent insulator section thickness and preventing structural defects, while maintaining the integrity of the laminate chip.
Implementation Method 1
the viscosity is 500 Pa·s to 2500 Pa·s
Implementation Method 2
more than one laminate chips are aligned, the one side surface of the laminate chip is pressed against a metal plate with any volume of grooves filled with the paste for insulator sections
Implementation Method 3
a solvent immiscible with the binder component to maintain electrical stability
Implementation Method 4
firing the laminate chip with the first insulator section and second insulator section formed
Data Source
AI summary
A method for manufacturing a laminated ceramic electronic component, which includes the steps of preparing a laminate chip having opposed end edges of internal electrodes exposed at opposed side surfaces of the laminate chip; forming a first insulator section and a second insulator section, respectively, on opposed side surfaces of the laminate chip by pressing against a metal plate with a volume of grooves filled with a paste, and swinging the metal plate in any direction when pulling the laminate chip away from the metal plate; and firing the laminate chip with the first insulator section and second insulator section formed thereon. The paste has a viscosity of 500 Pa·s to 2500 Pa·s, and a content C (vol %) of an inorganic solid satisfies a predetermined condition.