Ceramic Interposer Heat Spreading for Multi-Chip Packages
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Solution Overview
Problem
In multi-chip packages and stacked die architectures, conventional thermal management solutions face challenges due to high thermal resistance, leading to hotspot formation and potential die failure, as traditional silicon interposers are inadequate in mitigating thermal issues.
Innovation Solution
The use of high thermal conductivity ceramics as interposers and the incorporation of pedestals extending from the interposer to the integrated heat spreader provides alternative thermal paths, enhancing thermal energy spreading and reducing hotspot formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional silicon interposers are used, then electrical connectivity is achieved, but thermal management is insufficient leading to hotspot formation
Solution Approach 1:
The patent changes the material parameter of the interposer from traditional silicon to high thermal conductivity ceramic materials such as aluminum nitride (AlN) or silicon carbide (SiC). This material substitution dramatically increases thermal conductivity from approximately 150 W/mK for silicon to over 180 W/mK for AlN and 350 W/mK for SiC, enabling effective heat dissipation while maintaining electrical connectivity functions
Solution Approach 2:
The patent employs composite ceramic structures that combine multiple materials with complementary properties. For example, layered composites of aluminum nitride with copper heat spreaders, or ceramic-matrix composites incorporating thermal management fillers, create interposers that simultaneously provide electrical isolation, mechanical strength, and superior thermal conductivity to prevent hotspot formation
2Productivity
If die stacking is implemented to increase package density, then productivity is improved, but thermal resistance in vertical direction increases
Solution Approach 1:
The patent introduces lateral thermal conduction pathways within the interposer plane, complementing the vertical thermal path through the die stack. The high thermal conductivity ceramic interposer creates an extended thermal management surface area in the horizontal dimension, allowing heat to spread laterally before being dissipated, thereby reducing the effective thermal resistance of the vertical path without compromising package density
Solution Approach 2:
The ceramic interposer acts as a thermal intermediary between the stacked dies and the external environment. It provides dedicated thermal interface regions and heat spreader structures that mediate heat transfer from multiple die stacks, distributing thermal loads and reducing peak temperatures through its superior thermal conductivity and engineered thermal pathways
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly improves thermal management by reducing thermal resistance and preventing hotspot formation, thereby maintaining die performance and preventing throttling or failure.
Implementation Method 1
The use of high thermal conductivity ceramics as interposers and the incorporation of pedestals extending from the interposer to the integrated heat spreader provides alternative thermal paths, enhancing thermal energy spreading
Data Source
AI summary
Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a package substrate and an interposer over the package substrate. In an embodiment, the interposer comprises a ceramic. In an embodiment, the electronic package further comprises a first die over the interposer and a second die over the interposer. In an embodiment, the first die and the second die are electrically coupled together by the interposer. In an embodiment, the electronic package further comprises an integrated heat spreader (IHS) over the first die and the second die.