Ceramic Interposer Leadframe Package Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current leadframe packages for power management devices face challenges such as high cost, inferior thermal performance, higher inductance, larger size, and lower integration levels, which hinder the development of smaller, more efficient electronic products.
Innovation Solution
A substrate interposer with a leadframe, featuring an insulating interposer, a conductive redistribution layer with traces, and a semiconductor die, which provides improved electrical connections and thermal management through the use of materials like copper and ceramic, and advanced packaging techniques like OSP treatment and pillar connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional leadframe packages are used for power management devices, then manufacturing simplicity is maintained, but thermal performance deteriorates and inductance increases
Solution Approach 1:
The patent employs a composite package structure combining ceramic substrate, metal leadframe, and semiconductor die materials. The ceramic substrate provides superior thermal conductivity and electrical insulation properties, while the metal leadframe offers electrical connectivity. This composite approach resolves the contradiction by achieving improved thermal performance through material composition rather than simplifying the overall package structure.
Solution Approach 2:
The patent introduces a ceramic substrate as an intermediary component between the semiconductor die and the leadframe. This intermediary layer serves multiple functions: it provides thermal management pathways, electrical insulation, and mechanical support. By adding this intermediate element, the patent improves thermal performance without relying on direct metal-to-die contact that would increase inductance.
2Productivity
If discrete device manufacturing is used, then production cost is reduced, but integration level and device size increase
Solution Approach 1:
The patent merges multiple discrete components (semiconductor die, ceramic substrate, leadframe, and encapsulant) into a single integrated power management device package. By combining these elements into one unified structure, the patent achieves higher integration levels while reducing the overall device size compared to discrete component assemblies. The merged structure allows for compact arrangement of functional elements.
Solution Approach 2:
The patent utilizes three-dimensional packaging architecture, stacking components vertically rather than arranging them horizontally in a discrete layout. The semiconductor die is mounted on the ceramic substrate, which is in turn attached to the leadframe, creating a vertical integration scheme. This dimensional reorganization increases integration density and reduces the device footprint.
3Reliability
If copper clips and leadframe packages are used for integration, then electrical connectivity is achieved, but inductance increases and thermal performance deteriorates
Solution Approach 1:
The patent changes the physical parameters of the electrical connection path by using thick-trace ceramic substrate circuits instead of thin leadframe traces. The ceramic substrate provides wider, shorter current paths with lower inductance. Additionally, the patent modifies the thermal conduction parameters by incorporating high thermal conductivity materials in the ceramic substrate and optimizing the die-attach interface, thereby reducing thermal resistance while maintaining electrical connectivity.
Data Source
AI summary
In one general aspect, a device can include a leadframe including at least one of an external input terminal or an external output terminal, an interposer made of an insulating material, and a redistribution layer coupled to the interposer and made of a conductive material. The redistribution layer can include a plurality of traces. The device can also include a semiconductor die disposed between the redistribution layer and the leadframe.