Ceramic Interposer Structure for Fine-Pitch Signal Routing
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Solution Overview
Problem
Existing interposers face challenges in achieving high performance and reducing electronic device size while maintaining reliable signal transmission and dimensional stability, especially with increased data throughput and integration in devices like cameras and smartphones.
Innovation Solution
An interposer with a ceramic support body and conductive connection electrodes, featuring a shielding member and reinforcement parts, is designed to connect substrates, allowing for a fine pattern and reduced size, with the connection electrodes formed on the outer surface and via grooves to enhance strength and stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the area of substrate is reduced to lengthen battery lifetime, then battery mounting space is increased, but substrate area reduction makes fine pattern fabrication more difficult and reduces manufacturing precision
Solution Approach 1:
The patent transitions from planar substrate integration to three-dimensional interposer structure with multiple layers and vertical via holes. This dimensional change allows signal redistribution in the vertical direction, enabling fine pattern fabrication on reduced-area substrates while maintaining manufacturing precision through controlled layer thickness and via hole dimensions.
Solution Approach 2:
The interposer uses composite material structure combining conductive materials (copper, aluminum) for wiring layers with insulating materials (resin, glass fiber) for substrate layers. This composite approach enables precise pattern formation through material property differentiation, allowing fine pitch wiring while maintaining structural integrity on compact substrates.
2Productivity
If the number of layers is increased to reduce substrate area, then integration density is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The interposer structure is segmented into distinct functional layers: signal transmission layers with wiring patterns, insulation layers with dielectric materials, and connection layers with via holes. This segmentation allows independent optimization of each layer, reducing overall device complexity while achieving high integration density through systematic layer stacking.
Solution Approach 2:
The interposer acts as an intermediary component between the substrate and battery mounting area, redistributing signals through its multi-layer structure. This intermediary function enables the substrate to maintain smaller area while the interposer handles the complexity of signal routing across multiple layers, effectively decoupling substrate size from integration density requirements.
3Length of stationary object
If the thickness of substrate is reduced through fine pattern, then high degree of integration is achieved, but signal transmission reliability and dimensional stability deteriorate
Solution Approach 1:
The patent optimizes physical parameters including via hole diameter, wiring line width, and layer thickness to achieve fine pattern while maintaining signal integrity. By carefully controlling these parameters within specific ranges, the interposer achieves reduced thickness for high integration while preserving dimensional stability and signal transmission reliability through precise parameter management.
4Reliability
If via holes are formed through the support body to connect top and bottom surfaces, then electrical connection is improved, but manufacturing precision and structural strength may be compromised
Solution Approach 1:
Via holes are formed through the support body before final assembly and connection electrode attachment. This preliminary action allows precise positioning and formation of via holes while the support body structure is still accessible, improving manufacturing precision. The pre-formed via holes then serve as accurate templates for subsequent connection electrode placement, ensuring reliable electrical connection.
Data Source
AI summary
The present disclosure relates to an interposer. The interposer includes: a support body formed of a ceramic material, a connection electrode configured to the top surface and bottom surface of the support body, and a shielding member disposed at an outer surface of the support body. At least a part of the support body is disposed along the edge of a substrate, and electrically connects the substrate and a substrate. The interposer is formed of a ceramic material and thus make it possible to implement a fine pattern, to improve dimensional stability by preventing the bending deformation of ceramic green sheets, and to raise the reliability of signal transmission. Therefore, the interposer can contribute to implementing high performance of an electronic device and reducing the size of the electronic device.