Ceramic Ion Thruster Assembly for High-Temperature, Low-Cost Fabrication
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Solution Overview
Problem
Existing ion thrusters face challenges in achieving high temperature resistance and cost-effectiveness, particularly in the complex space environment of microsatellites, which require simple preparation processes and low manufacturing costs.
Innovation Solution
A modular fabrication method using prefabricated green ceramic chips, involving stacking and laminating to form the thruster's components, followed by sintering, which includes a high-temperature or low-temperature co-fired process to achieve high temperature resistance and reduce costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional ion thruster fabrication methods are used, then manufacturing precision can be achieved, but the process complexity and cost increase significantly
Solution Approach 1:
The ion thruster is divided into multiple green ceramic chips that are stacked and laminated in sequence. Each chip is prepared independently with specific structures (cathode holes, air intake holes, reaction chambers), and then assembled together through lamination to form the complete thruster, simplifying the overall fabrication process
Solution Approach 2:
Green ceramic chips are prepared in advance with pre-formed structures including cathode holes, air intake holes, and reaction chambers before final assembly. This preliminary preparation allows for simpler final assembly and reduces overall process complexity
2Ease of manufacture
If traditional ion thruster fabrication methods are used, then structural integrity can be achieved, but manufacturing cost increases
Solution Approach 1:
The ion thruster is fabricated using ceramic materials that provide both structural integrity and high temperature resistance. The ceramic chips are laminated and sintered to create a composite structure that maintains strength while reducing manufacturing costs compared to traditional metal-based approaches
Solution Approach 2:
The fabrication process utilizes sintering temperature parameters to achieve the desired structural properties. By controlling the sintering process, the ceramic material develops optimal density and strength characteristics necessary for high temperature operation
3Temperature
If ceramic materials are used for high temperature resistance, then thermal stability improves, but thermal conductivity decreases
Solution Approach 1:
Different regions of the ion thruster utilize ceramic materials with optimized properties for their specific functions. The reaction chamber and surrounding structures use ceramics with appropriate thermal conductivity for high temperature resistance, while electrode regions are designed with materials that facilitate necessary thermal management
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method results in an ion thruster with good high temperature resistance, corrosion resistance, long service life, and thermal conductivity, while maintaining a small overall size, suitable for various applications.
Implementation Method 1
stacking and laminating a plurality of prefabricated green ceramic chips to form a front portion
Implementation Method 2
placing the sintering mold in a heating furnace for sintering
Data Source
AI summary
Provided are an ion thruster and a fabrication method thereof. The method for fabricating the ion thruster comprises: stacking and laminating a plurality of prefabricated ceramic chips (p) to form a front portion (51); stacking and laminating a plurality of prefabricated green ceramic chips (p) to form a rear portion (B); assembling the front portion (51) and the rear portion (B) and placing in a sintering mold, and allowing the front portion (51) to be closely fitted with a tapered portion (b1) of the rear portion (B); placing a main cathode (1) into a cathode hole (k1) on the front portion and filling the cathode hole (k1) with a ceramic slurry to fix the main cathode (1); and placing the sintering mold in a heating furnace for sintering. For the ion thruster, a modular processing method is adopted. A method of stacking a plurality of prefabricated green ceramic chips (p) together and laminating them is used when each module is manufactured. The present application has the advantages of a simple process and low cost, and the fabricated ion thruster is small in size and has good high-temperature resistance.