Multilayer Ceramic Component Lamination for Flat Electrodes
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Solution Overview
Problem
Existing methods for producing multilayer ceramic electronic components often result in curved internal electrode layers and voids between the internal electrode and dielectric ceramic layers, affecting capacitance and potentially leading to moisture-related defects.
Innovation Solution
A method involving lamination of green sheets with internal electrode layers, followed by isotropic pressing, flattening to remove dents, and rigid pressing without elastic sheets to prevent curvature and void formation, ensuring flatness and contact between internal electrode and dielectric ceramic layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If compression bonding using elastic sheets is performed to enable the sheets to conform to steps in portions without internal electrode layers, then the elastic sheets can contact all portions of the laminate, but the internal electrode layers become curved along the dents formed in the portions without internal electrode layers
Solution Approach 1:
The patent applies preliminary flattening action by performing rigid pressing before compression bonding. This pre-flattening step prevents the formation of dents in portions without internal electrode layers, thereby preventing subsequent curvature of internal electrode layers while still allowing elastic sheets to conform to the laminate surface during compression bonding
Solution Approach 2:
The patent segments the pressing process into two distinct stages: (1) rigid pressing to flatten the laminate and prevent dent formation, and (2) compression bonding with elastic sheets to achieve uniform contact. This segmentation allows each stage to perform its specific function without causing the adverse effects that would occur if only one stage were used
2Stress or pressure
If rigid pressing is performed after compression bonding to press the laminate from both surfaces, then pressure is applied to the laminate, but voids form in the boundaries between the ends of internal electrode layers and dielectric ceramic layers due to lack of pressure in those boundaries
Solution Approach 1:
The patent performs preliminary flattening of the laminate before compression bonding, which ensures that the boundaries between internal electrode layers and dielectric ceramic layers are already in good contact. This preliminary action prevents void formation during subsequent rigid pressing, eliminating the need for additional measures to address boundary contact issues
3Ease of operation
If the portions without internal electrode layers are dented to allow elastic sheet contact, then the elastic sheets can conform to the laminate surface, but moisture can enter through voids formed in the boundaries affecting component reliability
Solution Approach 1:
The patent applies preliminary flattening to the laminate before compression bonding, which prevents the formation of dents and subsequent voids in the boundaries between internal electrode layers and dielectric ceramic layers. This eliminates moisture entry paths while still allowing elastic sheets to conform to the laminate surface during compression bonding, thereby maintaining both conformability and moisture resistance
Solution Approach 2:
The patent applies preliminary anti-action by flattening the laminate surface before compression bonding, which prevents the formation of dents that would otherwise create voids and moisture entry paths. This preliminary counter-action eliminates the harmful effect (moisture entry) before it can occur during the compression bonding process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method produces multilayer ceramic electronic components with reduced curvature of internal electrode layers and absence of voids, enhancing capacitance stability and reliability by maintaining uniform pressure and preventing moisture entry.
Implementation Method 1
compression bonding using elastic sheets makes dents in the portions without the internal electrode layer
Implementation Method 2
isotropic pressing step of subjecting the laminate to isotropic pressing
Data Source
AI summary
A method of producing a multilayer ceramic electronic component includes a lamination step of producing a laminate by laminating green sheets each with an internal electrode layer formed thereon, an isotropic pressing step of subjecting the laminate to isotropic pressing, a flattening step of shaving one or both of main surfaces of the isotropic pressed laminate to flatten the one or both of the main surfaces of the laminate, and a rigid pressing step of pressing the flattened laminate from both of the main surfaces with a rigid body on each of the main surfaces.