Laser Metal Deposition on Ceramic for Thin-Line Bonded Traces
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods struggle to bond a metal layer in a thin line shape directly to the surface of a ceramic substrate, particularly for copper-based and silver-based metals, due to difficulties in forming thin metal layers using techniques like molten metal bonding, thermal spraying, and brazing.
Innovation Solution
A method involving laser metal deposition is used to bond a metal layer to a ceramic substrate by heating the ceramic surface with a laser beam and simultaneously feeding a solid metal material, which is melted and deposited on the ceramic surface, forming a thin line shape.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If thermal spraying method is used to bond metal to ceramic surface, then metal layer can be formed, but it is difficult to form thin line shape
Solution Approach 1:
The patent replaces the mechanical thermal spraying system with a laser-based system. Instead of using thermal spray equipment to deposit metal powder, the invention uses laser beam to melt and deposit metal material directly onto the ceramic surface, enabling precise thin line formation while simplifying the manufacturing process.
Solution Approach 2:
The laser beam provides localized heating and melting only at the specific target area on the ceramic surface, allowing precise control of metal deposition in thin line shapes. This localized energy application enables high manufacturing precision without affecting surrounding areas.
2Adaptability or versatility
If molten metal bonding method is used, then metal layer can be bonded to ceramic, but it is difficult to form thin line shape and not suitable for copper-based metal
Solution Approach 1:
The invention changes the bonding parameters by using laser beam with controlled energy density and temperature distribution. By adjusting laser power, scanning speed, and focus position, the process can accommodate different metal materials including copper-based metals with high melting points, while simultaneously achieving thin line shape precision.
3Productivity
If conventional brazing method is used, then ceramic and metal can be bonded, but requires additional steps of applying brazing material and increases production load
Solution Approach 1:
The invention merges the metal layer formation process with the bonding process into a single laser metal deposition operation. Instead of separate steps for applying brazing material and then bonding, the laser simultaneously melts and bonds the metal material to the ceramic surface, eliminating additional process steps and increasing productivity.
Solution Approach 2:
The invention extracts the brazing material application step from the bonding process. By using laser metal deposition, the need for separate brazing paste application or brazing foil placement is eliminated, as the metal material is directly deposited and bonded in one operation.
4Manufacturing precision
If laser beam is used to melt metal material, then metal can be deposited on ceramic, but ceramic surface must be sufficiently heated for proper bonding
Solution Approach 1:
The laser beam performs preliminary heating of the ceramic surface before metal material deposition. This pre-heating action ensures the ceramic surface reaches the appropriate temperature for proper bonding, creating optimal conditions for subsequent metal material melting and adhesion, thereby ensuring high bonding quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the direct formation of a metal layer in a thin line shape on a ceramic substrate, enabling applications such as copper-based circuit patterns and silver-based brazing materials, reducing production load and cost.
Implementation Method 1
irradiating a surface of a ceramic substrate with a laser beam while sweeping the laser beam, and simultaneously therewith, feeding a solid metal material toward a region irradiated with the laser beam
Implementation Method 2
the metal material being fed is also brought into a state of being irradiated with the laser beam to melt the metal material while heating the surface of the ceramic substrate
Implementation Method 3
depositing the molten metal material on the surface of the ceramic substrate and then solidifying the metal material
Data Source
AI summary
[Problem] To directly bond a metal layer in a thin line shape to a surface of a ceramic substrate.[Solution] A method for producing a ceramic-metal bonded object including irradiating a surface of a ceramic substrate with a laser beam while sweeping the laser beam, and simultaneously therewith, feeding a solid metal material toward a region irradiated with the laser beam on the surface of the ceramic substrate (hereinafter referred to as “irradiation area”), so that the metal material being fed is also brought into a state of being irradiated with the laser beam to melt the metal material while heating the surface of the ceramic substrate located in the irradiation area, and depositing the molten metal material on the surface of the ceramic substrate and then solidifying the metal material.