Ceramic LED Mounting Package With Integrated Heat Dissipation

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Solution Overview

Problem

Conventional electrical element mounting packages have low heat dissipation performance due to high thermal resistance at the interfaces between the submount and joint material, and between the joint material and the metal base, which hinders effective heat transfer from the submount to the metal base.

Innovation Solution

An electrical element mounting package with a plate-like ceramic substrate and a protruding ceramic base, where the substrate and base are made integrally, eliminating the need for a joint material like solder and reducing thermal resistance, and incorporating side conductors and via conductors to enhance heat transfer to the substrate's large surface area for efficient dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a submount and metal base are connected with joint material (solder), then the electrical element can be mounted, but thermal resistance increases and heat dissipation performance deteriorates

Engineering Contradiction:

Improvejoint connection reliabilityVSAvoidheat dissipation efficiency

Core Design Contradiction:

ReliabilityVSLoss of energy

Solution Approach 1:

The submount and base are merged into a single integrally-formed ceramic component, eliminating the joint material interface that caused thermal resistance. The patent states that the submount and base are 'integrally formed of a ceramic material,' which removes the solder joint and its associated thermal barriers while maintaining structural connection.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The invention uses ceramic material for both the submount and base portions, creating a composite structure with uniform high thermal conductivity properties. The ceramic material provides both mechanical support and efficient heat dissipation pathways throughout the integrated component.

Inventive Principle:

Principle #40Composite materials

2Ease of manufacture

If joint material is used to connect submount to metal base, then assembly is achieved, but thermal resistance at interfaces increases

Engineering Contradiction:

Improveassembly feasibilityVSAvoidheat transfer efficiency

Core Design Contradiction:

Ease of manufactureVSLoss of energy

Solution Approach 1:

The submount and base are combined into a single integrally-formed component, eliminating the need for joint material and interface connections. This merging approach simplifies the manufacturing process by removing the soldering step while simultaneously improving heat transfer efficiency.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The joint material (solder) is extracted or removed from the structure entirely. By eliminating the joint material, the patent removes the thermal resistance interface while maintaining the functional connection between what would have been separate components.

Inventive Principle:

Principle #2Taking out (Extraction)

3Ease of operation

If conventional metal base with submount structure is used, then mounting function is provided, but heat dissipation performance is low

Engineering Contradiction:

Improveelectrical element mounting capabilityVSAvoidheat dissipation performance

Core Design Contradiction:

Ease of operationVSLoss of energy

Solution Approach 1:

The invention replaces the conventional metal base structure with an integrally-formed ceramic structure that provides both mounting functionality and superior heat dissipation. The ceramic material's high thermal conductivity enables efficient heat transfer while the integrated design maintains electrical element mounting capability.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The mounting function and heat dissipation function are merged into a single integrally-formed ceramic component, eliminating the need for separate submount and base structures. This integration improves heat dissipation while maintaining the electrical element mounting capability.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution achieves high heat dissipation performance by eliminating thermal resistance interfaces and using ceramic materials with high thermal conductivity, such as aluminum nitride, to effectively transfer heat from the electrical element to the substrate, thereby improving the reliability and efficiency of the mounting package.

Implementation Method 1

the substrate and the at least one base are made of ceramics integrally... effectively transfer heat from the electrical element to the substrate

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11784459B2Electrical element mounting package, array package, and electrical device

Publication Date: 2023.10.10 KYOCERA CORP

AI summary

A light emitting element mounting package includes a plate-like substrate and a base that protrudes from a front surface of the substrate and has a mounting surface on which a light emitting element is mounted. A power supply terminal is provided on the front surface of the substrate, and the power supply terminal is arranged in a direction that is opposite to a direction where an emitting surface of the light emitting element is oriented. The light emitting element mounting package further includes a wiring conductor inside the substrate, wherein the wiring conductor extends to a side of the power supply terminal where one end thereof is positioned at a side of the power supply terminal with respect to the emitting surface of the light emitting element and the other end thereof is electrically connected to the power supply terminal.