Ceramic LED Module With Through Conductor Heat Dissipation
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Solution Overview
Problem
Conventional LED modules face challenges in achieving high luminance, efficient heat radiation, compact design, and optimal color temperature while maintaining color rendering properties, with limitations in producing white light with desired color temperature and high Ra value.
Innovation Solution
The LED module incorporates a ceramic base plate with a frame unit made of resin, featuring a through conductor and pads for heat transfer, and includes multiple LED chips with different fluorescent resins to achieve varying color temperatures, along with a reflector surface for light scattering, enhancing luminance and compactness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If LED chips are used to emit high luminance light, then illumination intensity is improved, but heat generation increases causing substrate deformation
Solution Approach 1:
The patent extracts the heat-generating LED chips from the glass epoxy substrate and mounts them on a ceramic substrate instead. The ceramic substrate is specifically chosen for its superior heat dissipation properties, effectively separating the light generation function from the heat management function. This extraction resolves the contradiction by allowing high luminance emission while preventing excessive substrate temperature through material substitution.
Solution Approach 2:
The patent changes the substrate material parameter from glass epoxy to ceramic, which fundamentally alters the thermal conductivity parameter. Ceramic materials have higher thermal conductivity, enabling efficient heat dissipation from the LED chips. This parameter change allows the system to maintain high luminance output while controlling operating temperature, resolving the trade-off between light intensity and heat generation.
2Temperature
If fluorescent resin is used to convert blue light to white light, then color temperature is adjusted, but manufacturing complexity increases
Solution Approach 1:
The patent applies different fluorescent resins with specific characteristics to different regions or positions on the ceramic substrate. Each fluorescent resin is selected for its optimal performance in converting blue LED light to specific wavelength ranges. This localized application of specialized materials achieves precise color temperature control while maintaining manufacturing feasibility through standardized material selection and placement procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables high luminance, efficient heat radiation, and adjustable color temperature, while improving the color rendering index (Ra value), addressing the limitations of conventional LED modules in producing white light with desired properties.
Implementation Method 1
LED chips 931, 932 and 933 emit red, green and blue light, respectively
Implementation Method 2
The fluorescent resin 94 emits yellow light by absorbing blue light emitted from the LED chip 92. The LED module 900b emits white light by mixing the blue light and the yellow light
Implementation Method 3
heat transfer from the LED unit to the bottom surface via the pads, the main surface exposed portion and the bottom surface reaching portion
Implementation Method 4
a reflector surface for light scattering
Data Source
AI summary
An LED (Light Emitting Diode) module includes an LED unit having one or more LED chips and a case. The case includes: a body including a base plate made of ceramic, the base plate having a main surface and a bottom surface opposite to the main surface; a through conductor penetrating through the base plate; and one or more pads formed on the main surface and making conductive connection with the through conductor, the pads mounting thereon the LED unit. The through conductor includes a main surface exposed portion exposed to the main surface and overlapping the LED unit when viewed from top, a bottom surface reaching portion connected to the main surface exposed portion and reaching the bottom surface. The pads cover at least a portion of the main surface exposed portion.