Ceramic LED Package with Protrusions for Direct PCB Connection
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The complexity of the manufacturing process for LED chip package structures is increased due to the need for conductive pins to be bent twice to connect with a PCB, which complicates the electrical connection.
Innovation Solution
A ceramic substrate with protrusions and a hollow ceramic casing is used, where conductive layers are formed on the protrusions, and the hollow casing is fixed on the substrate using LTCC, allowing LED chips to be easily connected to a PCB without bending conductive pins.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive pins are bent twice to connect with PCB, then electrical connection is achieved, but manufacturing process complexity increases
Solution Approach 1:
The conductive pin is segmented into multiple sections with different functions: a first section for electrical connection to LED chip, a second section for mechanical support, and a third section for PCB mounting. This segmentation allows each section to be optimized independently, eliminating the need for complex bending while maintaining reliable electrical connection.
Solution Approach 2:
The conductive pin transitions from a two-dimensional planar bending structure to a three-dimensional multi-section structure extending in multiple spatial dimensions. The pin extends vertically from PCB, horizontally to LED chip, and provides mechanical support in intermediate dimensions, simplifying the manufacturing process while achieving reliable connection.
2Reliability
If conductive pins are bent twice to connect with PCB, then electrical connection is achieved, but production efficiency decreases
Solution Approach 1:
The conductive pin is pre-formed with its multi-section structure before assembly, including pre-positioned electrical connection surfaces and mechanical support sections. This preliminary formation eliminates the need for complex bending operations during final assembly, significantly improving production efficiency while ensuring reliable electrical connection.
Solution Approach 2:
The multi-section conductive pin structure provides self-alignment and self-positioning features during assembly, where the different sections automatically guide the pin into the correct position relative to PCB and LED chip. This self-service capability reduces manual intervention and complex positioning operations, enhancing production efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the manufacturing process by allowing direct electrical connection between the LED chip package and a PCB, reducing complexity and improving efficiency.
Implementation Method 1
The hollow ceramic casing is fixed on a top face of the ceramic substrate via an LTCC (Low-Temperature Cofired Ceramics)
Data Source
AI summary
An LED chip package structure using a ceramic material as a substrate includes a ceramic substrate, a conductive unit, a hollow ceramic casing, a plurality of LED chips, and a package colloid. The ceramic substrate has a main body, and a plurality of protrusions extended from three faces of the main body. The conductive unit has a plurality of conductive layers formed on the protrusions, respectively. The hollow casing is fixed on a top face of the main body to form a receiving space for exposing a top face of each conductive layer. The LED chips are received in the receiving space, and each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected to different conductive layers. In addition, the packaging colloid is filled into the receiving space for covering the LED chips.