Ceramic-Insulated Multi-Metal Substrate for LED Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing light-emitting devices face issues with low mechanical strength and insufficient heat dissipation due to the use of insulating resin layers with low thermal conductivity, leading to potential breakage and inadequate heat transfer from the light-emitting elements.
Innovation Solution
A substrate structure is developed using metal flat plates separated by ceramic insulating portions, with an insulating upper surface coating film covering the substrates and exposing element placing regions, allowing for high thermal conductivity and mechanical strength through the integration of ceramic insulating layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an insulating resin layer is used to connect metal busbars, then electrical insulation is achieved, but mechanical strength of the connecting part becomes low
Solution Approach 1:
The patent uses a composite structure combining metal busbars with ceramic insulating portions. The ceramic material provides both electrical insulation and high mechanical strength, resolving the contradiction between needing insulation and maintaining structural integrity during manufacturing processes.
2Reliability
If an insulating resin layer is used to connect metal busbars, then electrical insulation is achieved, but heat dissipation becomes insufficient
Solution Approach 1:
The patent replaces low thermal conductivity resin with high thermal conductivity ceramic material. This composite structure maintains electrical insulation while enabling efficient heat transfer from the light-emitting element through the metal substrates and ceramic insulating portions to heat sinks, resolving the heat dissipation problem.
3Strength
If ceramic insulating portions are used to connect metal substrates, then mechanical strength and heat dissipation are improved, but manufacturing complexity increases
Solution Approach 1:
The patent divides the substrate into multiple metal substrates separated by ceramic insulating portions. This segmentation allows independent fabrication of metal components followed by assembly with ceramic insulators, simplifying the overall manufacturing process compared to creating a monolithic complex structure.
Solution Approach 2:
The ceramic insulating portions act as intermediary elements that connect metal substrates both mechanically and thermally. This mediator approach simplifies the design by using a standardized connecting component that handles both insulation and heat transfer functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a light-emitting device with enhanced mechanical strength and efficient heat dissipation by utilizing ceramic insulating portions to conduct heat effectively and maintain structural integrity.
Implementation Method 1
since the connecting part is made of resin having a low coefficient of thermal conductivity, heat generated from a light-emitting element connected on the first busbar might not be sufficiently transferred to the second busbar, and heat dissipation of the light-emitting element may be insufficient
Data Source
AI summary
A light-emitting device of the present invention includes a plurality of substrates, an insulating portion, and an insulating upper surface coating film. The plurality of metal substrates are placed side by side to be separated from one another. The insulating portion is made of ceramic and fills the clearance. The insulating upper surface coating film is formed so as to integrally cover respective one substrate surfaces of the plurality of substrates and has an opening portion that spreads over the one substrate surface of one substrate among the plurality of substrates and the one substrate surface of another substrate adjacent to the one substrate across the clearance. The opening portion exposes an element placing region for placing an element.