Ceramic LED Mounting Substrate With Parallel Wiring for Pulse Stability
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Solution Overview
Problem
Conventional substrates for mounting light-emitting elements face challenges in reducing wiring inductance, leading to decay of pulse waveforms and variations in light emission output when pulse-driven by an external power source.
Innovation Solution
A substrate with a ceramic composition featuring parallel conductors and via conductors that connect terminals for the light-emitting element and power source, reducing inductance and maintaining a rectangular pulse waveform, while also improving heat dissipation and stress management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional wiring structures are used in substrates for mounting light-emitting elements, then the substrate can be manufactured with standard processes, but the wiring inductance cannot be reduced sufficiently, causing pulse waveform decay and light emission output variations
Solution Approach 1:
The wiring part is segmented into multiple conductor layers (first conductor layer, second conductor layer) with via conductors connecting them. This segmentation allows the wiring inductance to be reduced by distributing the current path across multiple segments in parallel, thereby improving pulse waveform stability without requiring a complete redesign of the manufacturing process
Solution Approach 2:
The patent transitions from a single-plane wiring structure to a multi-layer three-dimensional wiring structure. By adding conductors in different layers (first conductor layer near the light-emitting element, second conductor layer at a different position) connected via via conductors, the current path is optimized in the vertical dimension, reducing inductance and improving pulse waveform stability
2Reliability
If the wiring inductance is reduced to maintain pulse waveform stability, then light emission output variations are minimized, but the wiring structure becomes more complex
Solution Approach 1:
Multiple conductors (first conductor, second conductor) are merged into parallel paths within the substrate. The via conductors merge the first conductor layer and second conductor layer into a unified multi-path wiring system, reducing overall inductance and stabilizing light emission output while keeping the structure integrated rather than separate components
3Temperature
If standard substrate materials are used, then manufacturing is straightforward, but heat dissipation and stress management are insufficient
Solution Approach 1:
The substrate uses a composite structure combining ceramic material with integrated conductor layers and via conductors. The ceramic substrate provides excellent thermal conductivity for heat dissipation from the light-emitting element, while the metallized via conductors and conductor layers form an integrated thermal and electrical management system, balancing thermal performance with manufacturability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively maintains a stable pulse waveform, reduces light emission output variations, enhances thermal conductivity, and improves the reliability of the substrate by minimizing stress and optimizing heat release.
Implementation Method 1
the wiring part has a first conductor that extends in a surface direction of the substrate, and a second conductor that extends in substantially parallel to the first conductor on an opposite side of the front surface and is connected in parallel with the first conductor
Implementation Method 2
A substrate with a ceramic composition featuring parallel conductors and via conductors that connect terminals for the light-emitting element and power source, reducing inductance and maintaining a rectangular pulse waveform, while also improving heat dissipation and stress management
Data Source
AI summary
A substrate for mounting a light-emitting element includes a substrate that is composed of a ceramic(s), a terminal for an element that is provided on a front surface of the substrate where a light-emitting element is mounted thereon, a terminal for a power source that is provided on the substrate where an external power source is connected thereto, and a wiring part that is provided inside the substrate and electrically connects the terminal for an element and the terminal for a power source. Furthermore, the wiring part includes a first conductor that extends in a surface direction of the substrate and a second conductor that extends substantially parallel to the first conductor on an opposite side of the front surface and is connected in parallel with the first conductor.