Ceramic Light-Emitting Module Layout for Compact Heat Dissipation
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Solution Overview
Problem
The challenge is to reduce the volume of high-power light-emitting modules, enhance heat dissipation performance, and improve reliability without affecting optoelectronic parameters, while addressing the issues of large heat sinks and opaque packaging materials.
Innovation Solution
The solution involves using a double-sided copper-clad ceramic substrate with a light condensation cavity and optical components, a nickel-plated gold layer, and a dam to focus light, along with a fixing protection structure to enhance reliability, and incorporating solder resist inks to prevent solder creeping and stress release features to improve bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat sink with a large volume is disposed behind the light-emitting module to ensure heat dissipation performance, then the heat dissipation performance is improved, but the overall volume of the light-emitting module increases
Solution Approach 1:
The patent merges the substrate and heat sink into an integrated structure where the back surface of the substrate serves as the heat dissipation component. This eliminates the need for a separate large-volume heat sink while maintaining effective heat dissipation through the substrate's thermal conduction properties.
Solution Approach 2:
The substrate is designed to perform multiple functions simultaneously: it provides mechanical support for mounting light-emitting elements and driver IC chips, serves as an electrical connection platform through circuit wires, and acts as a heat dissipation component through its back surface. This multi-functionality reduces the need for separate dedicated heat sink structures.
2Ease of manufacture
If the light-emitting module is packaged with an opaque plastic package material in a fully wrapping manner, then the integrated packaging is improved, but the light-emitting performance is negatively impacted
Solution Approach 1:
The patent applies different packaging qualities to different regions: the first light-emitting element is packaged with an opaque plastic package material for protection and integration, while the second light-emitting element is packaged with a transparent plastic package material that allows light to pass through. This local differentiation maintains integrated packaging benefits while preserving light-emitting performance where needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly reduces module volume, enhances heat dissipation, improves light-emitting performance, and increases reliability by focusing light and preventing solder issues, while maintaining integrated packaging efficiency.
Implementation Method 1
a light condensation cavity is disposed in the plastic encapsulation body and covers above the light-emitting element
Implementation Method 2
The substrate is a double-sided copper-clad ceramic substrate
Implementation Method 3
a nickel-plated gold layer is further disposed on the substrate
Implementation Method 4
a solder resist ink is disposed between pins of the light-emitting element, the driver IC chip and the multiple passive devices and the multiple bonding wires
Data Source
AI summary
A light-emitting module includes a lead frame, a substrate, a light-emitting element, a plastic encapsulation body, a driver IC chip and multiple passive devices. The substrate is disposed on the lead frame, and the light-emitting element, the driver IC chip and the multiple passive devices are disposed on the substrate. The substrate is a double-sided metal-plated insulated substrate. The plastic encapsulation body at least covers part of the lead frame, and a light condensation cavity is disposed in the plastic encapsulation body and covers above the light-emitting element. Circuit wires are further etched on the substrate, and the light-emitting element, the driver IC chip and the multiple passive devices are correspondingly connected based on the circuit wires.