Curved Ceramic Mastercard Separation With Flattened Laser Cutting
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Solution Overview
Problem
Existing methods for separating ceramic substrates from a mastercard often result in damages such as cracks, microcracks, or chipping, which can negatively affect the performance of power semiconductor modules.
Innovation Solution
A method involving laser processes to create perforations and controlled cuts along predefined lines, with partial overlap, and optionally heating or flattening the mastercard to reduce stress, followed by removing sacrificial areas to minimize damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a single laser process is used to cut through the entire thickness of the ceramic mastercard, then the separation process is simple and fast, but the ceramic substrates are prone to uncontrolled breaking, cracks, and chipping at the edges
Solution Approach 1:
The single laser cutting process is segmented into two distinct processes: a first laser process that creates perforations by reducing thickness along first predefined lines, and a second laser process that cuts through the entire thickness along second predefined lines. This segmentation allows each process to be optimized independently, with the first process preparing the material and the second process performing the clean cut, thereby resolving the contradiction between speed and precision.
Solution Approach 2:
The first laser process performs a preliminary action by creating perforations and reducing the thickness of the ceramic mastercard along first predefined lines before the actual cutting occurs. This preliminary thinning of the ceramic at specific locations facilitates the subsequent clean cutting by the second laser process, preventing uncontrolled breaking while maintaining overall process efficiency.
2Productivity
If the curved ceramic mastercard is cut directly without flattening, then the process is simpler and faster, but stress concentration during cutting causes increased substrate damage
Solution Approach 1:
The method applies a preliminary action by heating the curved ceramic mastercard to flatten it before the laser cutting process begins. This pre-flattening step eliminates stress concentrations that would otherwise cause uncontrolled breaking during cutting, ensuring substrate integrity while maintaining processing efficiency through automation.
Solution Approach 2:
The method changes the temperature parameter of the ceramic mastercard by heating it to a specific temperature range where the material becomes more compliant and easier to flatten. This parameter change allows the curved mastercard to be transformed into a flat state, reducing internal stresses and enabling clean cutting without compromising substrate integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces or eliminates substrate damage during separation, ensuring high-quality substrates for semiconductor modules by minimizing cracks and microcracks.
Implementation Method 1
forming a plurality of perforations in a ceramic mastercard by a first laser process, wherein forming the plurality of perforations includes reducing a first thickness of the ceramic mastercard to a second thickness
Data Source
AI summary
A method includes flattening a ceramic mastercard that is curved and, while the ceramic mastercard is being flattened, cutting through an entire thickness of the ceramic mastercard along predefined lines by a laser process such that the ceramic mastercard is divided into separate substrates.