Ceramic Chamber Component Megasonic Cleaning for Particle Control
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Solution Overview
Problem
Conventional cleaning methods for ceramic components in semiconductor wafer plasma processing chambers are ineffective in removing submicron to nanometer-sized particles, leading to defects and increased startup time, yield loss, and productivity issues due to the inability to achieve reproducible low particle steady state process conditions.
Innovation Solution
A method and apparatus utilizing a megasonic conditioning solution with a scanning megasonic transducer head applying high-frequency megasonic energy to ceramic components, combined with a preconditioning and post-processing sequence, effectively removes submicron and nanometer-sized particles by leveraging high-pressure waves to dislodge particles from complex surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional cleaning methods are used for ceramic components, then the cleaning process is simple and quick, but submicron to nanometer-sized particles cannot be effectively removed
Solution Approach 1:
The patent employs ultrasonic vibration to generate cavitation bubbles in the cleaning solution, which collapse to create micro-jets that dislodge particles from ceramic surfaces. The ultrasonic transducer converts electrical energy to mechanical vibrations at frequencies typically between 20-100 kHz, creating intense localized cleaning action that removes submicron and nanometer particles effectively.
Solution Approach 2:
The patent utilizes hydraulic principles by immersing ceramic components in a liquid cleaning solution and using fluid dynamics to enhance particle removal. The cleaning solution flows over component surfaces while ultrasonic energy is applied, creating a combined hydrodynamic and ultrasonic cleaning effect that improves particle detachment and suspension.
2Productivity
If conventional cleaning methods are used, then the process time is short, but particle defects remain and require extended seasoning time
Solution Approach 1:
The patent performs preliminary ultrasonic cleaning of ceramic components before they are installed in the plasma processing chamber. This pre-cleaning action removes particles that would otherwise require extended seasoning time to be naturally depleted, thereby reducing the overall time required to achieve low particle steady state conditions in the chamber.
Solution Approach 2:
The ultrasonic cleaning process operates continuously or in repeated cycles, maintaining constant cleaning action on all surfaces of the ceramic component. This continuous energy application ensures thorough particle removal from complex geometries, including internal channels and recesses, without requiring prolonged seasoning time after component installation.
3Reliability
If conventional cleaning methods are used, then resource consumption is low, but yield loss increases due to particle defects
Solution Approach 1:
The patent changes the physical parameters of the cleaning process by using ultrasonic frequencies and intensities that optimize particle removal efficiency. By adjusting frequency, power density, and cleaning solution composition, the process achieves superior particle removal that reduces wafer yield loss from particle defects, making the increased resource consumption worthwhile.
Solution Approach 2:
The patent introduces a cleaning solution as an intermediary medium between the ultrasonic energy source and the ceramic component surfaces. This liquid medium transmits ultrasonic energy effectively while also providing chemical cleaning action, allowing particles to be suspended and removed without direct mechanical contact that might damage the ceramic surfaces.
4Speed
If conventional cleaning methods are used, then the equipment is simple, but startup time increases due to inability to achieve low particle steady state
Solution Approach 1:
The ultrasonic cleaning apparatus uses mechanical vibration at high frequencies to rapidly remove particles from ceramic components during manufacturing or maintenance. This accelerated particle removal capability reduces the time required to achieve low particle steady state conditions in the plasma chamber, thereby reducing overall startup time despite the added equipment complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves superior cleanliness of ceramic surfaces, reducing particle defects and shortening seasoning times, thereby enhancing productivity and reducing resource consumption by effectively removing submicron to nanometer-sized particles, as demonstrated by scanning electron micrograph results showing clean alumina and yttria surfaces.
Implementation Method 1
A megasonic transducer head comprises at least one megasonic transducer to provide megasonic energy to the megasonic conditioning solution, wherein the megasonic energy is delivered to the component via the megasonic conditioning solution
Implementation Method 2
Megasonic energy is applied through the megasonic conditioning solution to the component to clean the component
Data Source
AI summary
A method for conditioning a component of a wafer processing chamber is provided. The component is placed in an ultrasonic conditioning solution in an ultrasonic solution tank. Ultrasonic energy is applied through the ultrasonic conditioning solution to the component to clean the component. The component is submerged in a megasonic conditioning solution in a tank. Megasonic energy is applied through the megasonic conditioning solution to the component to clean the component.