Ceramic Device Metal Circuit Positioning via Low-Temperature Curing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current manufacturing methods for ceramic devices with metal circuits suffer from significant position accuracy errors due to high-temperature sintering, leading to large antenna frequency offsets and the need for manual repairs.
Innovation Solution
A ceramic device manufacturing method involving surface activation treatment and electroless plating processes to form patterned metal layers on ceramic materials without high-temperature sintering, ensuring precise metal circuit placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high-temperature sintering is used to cure silver paste on ceramic material, then the metal circuit can be formed, but position accuracy error increases significantly (5% to 14%)
Solution Approach 1:
The patent changes the temperature parameter from high-temperature sintering to low-temperature curing process, and changes the chemical form from metallic silver paste to organic-intrated silver compound paste, enabling curing at lower temperatures while maintaining circuit formation reliability
Solution Approach 2:
The patent utilizes the phase transition of organic-intrated silver compounds during low-temperature curing, where the organic binder decomposes and burns off, leaving behind pure silver metal circuits without requiring high-temperature sintering
2Reliability
If silver paste screen printing and high-temperature sintering are used, then metal circuit can be formed, but antenna frequency offset increases due to position accuracy error
Solution Approach 1:
The patent changes the curing temperature parameter from high-temperature sintering to low-temperature curing, and changes the paste composition from metallic silver to organic-intrated silver compounds, enabling precise circuit placement while maintaining electrical conductivity
Solution Approach 2:
The patent performs preliminary patterning of the organic-intrated silver compound paste before curing, allowing precise positioning of metal circuits to be established in advance, which prevents frequency offset issues
3Reliability
If high-temperature sintering is used to form metal circuits, then silver paste can be cured, but manual repair work increases due to position accuracy errors
Solution Approach 1:
The patent changes the processing temperature from high-temperature sintering to low-temperature curing and modifies the paste composition to organic-intrated silver compounds, enabling one-time precise formation of metal circuits without subsequent manual repairs
Solution Approach 2:
The low-temperature curing process with organic-intrated silver compounds enables self-aligned circuit formation that is self-correcting, eliminating the need for manual inspection and repair operations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves good position accuracy for metal circuits in ceramic devices, reducing the need for manual repairs and improving antenna frequency stability.
Implementation Method 1
a first metal layer is formed on the surface of the ceramic material after the surface activation treatment via an electroless plating process
Data Source
AI summary
A ceramic device including a ceramic material, a patterned metal structure, and a surface activation material is provided. A surface of the ceramic material at least includes a first surface and a second surface that are not coplanar. The ceramic material has recesses on the surface thereof. The patterned metal structure is disposed on the first surface and the second surface. The surface activation material is disposed on a surface of the recesses and located at an interface between the ceramic material and the patterned metal structure.