Ceramic-Metal Heat Dissipating Structure With Non-Sintered Carrier Layer
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Solution Overview
Problem
Conventional heat dissipating components made of composite materials face challenges in achieving both good thermal conductivity and mechanical properties while requiring complex manufacturing processes.
Innovation Solution
A heat dissipating structure comprising a non-sintered ceramic-based carrier layer with incorporated high thermal conductivity materials and a metal surface layer, which is coated on the outside, allowing for a simple manufacturing process and improved thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional composite material-based heat dissipating structures are used, then good thermal conductivity and mechanical properties can be achieved, but the manufacturing process becomes complex
Solution Approach 1:
The patent uses a composite structure consisting of a ceramic layer and a metal-ceramic composite layer, where the metal-ceramic composite layer contains ceramic particles dispersed in a metal matrix. This composite material approach achieves both good thermal conductivity (heat transfer coefficient of 180-1000 W/mK) and mechanical properties while simplifying the manufacturing process compared to conventional multi-material composite structures.
2Ease of manufacture
If multiple heat dissipating materials are combined, then manufacturing costs are reduced and performance is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The heat dissipating structure is segmented into two main layers: a ceramic layer providing thermal stability and a metal-ceramic composite layer providing both mechanical strength and thermal conductivity. This segmentation allows each layer to be optimized independently for its specific function while using cost-effective materials, reducing overall manufacturing cost without significantly increasing process complexity.
Solution Approach 2:
Different regions of the heat dissipating structure have different material compositions tailored to local requirements: the ceramic layer provides thermal stability where needed, while the metal-ceramic composite layer provides enhanced thermal conductivity and mechanical strength in the heat dissipation zones. This local optimization allows cost-effective material selection in each region.
3Strength
If sintering process is used for ceramic-based structures, then good mechanical properties are achieved, but the manufacturing process becomes complex and costly
Solution Approach 1:
The patent changes the key parameter of the manufacturing process from high-temperature sintering to a lower-temperature metal infiltration process. The metal-ceramic composite layer is formed by infiltrating molten metal into a pre-formed ceramic Green body, which then solidifies to create a mechanically strong composite structure without requiring complex sintering equipment or high-energy input.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure achieves high thermal conductivity with a heat transfer coefficient of 180 W/mK to 1,000 W/mK, stiffness modulus of 150 GPa to 250 GPa, and thermal expansion coefficient of 3 to 20, while being easy to manufacture and cost-effective.
Implementation Method 1
The non-sintered ceramic-based carrier layer is incorporated therein with at least one high thermal conductivity material... the heat dissipating structure has a heat transfer coefficient from 180 W/mK to 1,000 W/mK
Implementation Method 2
The metal surface layer is coated on an outside of the non-sintered ceramic-based carrier layer
Data Source
AI summary
A heat dissipating structure having high thermal conductivity includes a non-sintered ceramic-based carrier layer and a metal surface layer. The non-sintered ceramic-based carrier layer is incorporated therein with at least one high thermal conductivity material. The metal surface layer is coated on an outside of the non-sintered ceramic-based carrier layer.