Ceramic-Metal Heat Dissipation Unit for Handheld Devices

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Solution Overview

Problem

Handheld electronic devices face challenges in heat dissipation due to miniaturization and lightweight designs, leading to overheating and reduced device lifetime, even with metal alloy cases that fail to effectively dissipate heat.

Innovation Solution

A heat dissipation unit with a ceramic heat absorption section and a heat dissipation conductor section, where the ceramic material with low thermal expansion and high heat resistance conducts heat from the device interior to the exterior through the conductor, enhancing heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Weight of moving object

If the electronic device is miniaturized and made lightweight, then the portability and user comfort are improved, but the heat dissipation capability deteriorates

Engineering Contradiction:
Improvedevice weightVSAvoidheat dissipation capability
Core Design Contradiction:
Weight of moving objectVSTemperature

Solution Approach 1:

The case is divided into two distinct sections: a heat absorption section made of ceramic material and a heat dissipation section made of metal alloy. This segmentation allows each section to perform its specific function optimally - the ceramic section absorbs heat from internal components while the metal section dissipates heat to the external environment, resolving the heat dissipation problem in miniaturized devices.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different materials with different thermal properties are applied to different parts of the case. The heat absorption section uses ceramic material with high heat resistance and low thermal expansion coefficient, while the heat dissipation section uses metal alloy with high thermal conductivity. This local quality differentiation enables effective heat management in a compact design.

Inventive Principle:
Principle #3Local quality

2Strength

If metal alloy material is used for the case, then the strength and appearance are improved, but the heat dissipation performance remains insufficient

Engineering Contradiction:
Improvecase strengthVSAvoidheat dissipation performance
Core Design Contradiction:
StrengthVSTemperature

Solution Approach 1:

The case employs a composite structure combining ceramic material and metal alloy material. The ceramic heat absorption section provides heat resistance and dimensional stability, while the metal heat dissipation section provides structural strength and thermal conductivity. This composite material approach achieves both mechanical strength and effective heat dissipation performance.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively prolongs the device's lifetime and improves efficiency by quickly dissipating heat from the device, addressing the limitations of conventional designs.

Implementation Method 1

The heat generated inside the handheld electronic device can be quickly conducted from the heat absorption section to the heat dissipation section

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

the heat dissipation section is made of heat dissipation conductor. The heat generated inside the handheld electronic device can be quickly conducted from the heat absorption section to the heat dissipation section and then conducted from the heat dissipation section to outer side of the handheld electronic device

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10101779B2Heat dissipation unit of handheld electronic device
Publication Date: 2018.10.16 ASIA VITAL COMPONENTS CO LTD
  • US10101779B2 patent drawing
  • US10101779B2 patent drawing
  • US10101779B2 patent drawing

AI summary

A heat dissipation unit of handheld electronic device is applied to and assembled with a handheld electronic device. The heat dissipation unit includes a main body having a heat absorption section and a heat dissipation section respectively disposed on two sides of the main body. The heat absorption section is made of ceramic material. The heat dissipation section is a heat dissipation conductor. The heat absorption section and the heat dissipation section are respectively correspondingly positioned in the handheld electronic device and outside the handheld electronic device. The heat generated inside the handheld electronic device can be quickly conducted from the ceramic-made heat absorption section to the heat dissipation section and then conducted from the heat dissipation section to outer side of the handheld electronic device. Accordingly, the lifetime of the handheld electronic device is prolonged and the efficiency of the handheld electronic device is enhanced.