Ceramic-Metal Substrate Laser Scribing Amorphous Phase Control
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Solution Overview
Problem
The formation of amorphous phases during laser ablation in ceramic-metal substrates leads to wild breakages, contamination, and surface scratches, making the processing of these substrates challenging and inefficient.
Innovation Solution
A ceramic-metal substrate with a controlled amount of amorphous phases, limited to a width of at most 100 µm, is produced using laser ablation, where the amorphous phases extend parallel to the scribing line or cutting edge, optimizing the processing conditions to minimize stress and breakages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If laser ablation is used to create scribing lines in ceramic substrates, then cutting efficiency is improved, but amorphous phases form causing wild breakages and surface defects
Solution Approach 1:
The patent applies parameter changes by optimizing laser processing parameters (power, speed, pulse duration) to control the formation of amorphous phases. By adjusting these parameters, the process achieves efficient cutting while limiting amorphous phase formation to a controlled width, preventing wild breakages and surface defects
Solution Approach 2:
The patent applies partial action by allowing limited amorphous phase formation (within a controlled width) rather than completely preventing it. This controlled partial formation achieves the desired balance between cutting efficiency and surface quality, avoiding the excessive action of completely eliminating amorphous phases which would reduce productivity
2Ease of manufacture
If laser ablation creates scribing lines, then substrate separation is enabled, but stress and wild breakages occur due to amorphous phase formation
Solution Approach 1:
The patent uses parameter changes to optimize laser processing conditions, controlling amorphous phase formation width through adjusted power, speed, and pulse parameters. This enables reliable substrate separation along predetermined lines while maintaining overall substrate integrity and preventing wild breakages
3Productivity
If high processing speeds are used for laser ablation, then productivity increases, but amorphous phase formation increases causing more defects
Solution Approach 1:
The patent applies parameter changes by optimizing the relationship between processing speed and other laser parameters (power, pulse duration). This allows high productivity through increased speed while compensating with adjusted power and pulse parameters to limit amorphous phase formation and its associated contamination
Solution Approach 2:
The patent uses periodic action through pulsed laser operation. By applying laser energy in controlled pulses rather than continuous operation, the process achieves high processing speeds while allowing thermal diffusion between pulses, thereby limiting amorphous phase formation and reducing contamination
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces wild breakages and stress in the ceramic substrate by limiting the amorphous phase width, enhancing the processing efficiency and reducing contamination, allowing for easier separation and cutting of the ceramic-metal substrates.
Implementation Method 1
the ceramic substrate is melted by the laser beam and the associated introduction of thermal energy
Implementation Method 2
the ceramic substrate is melted by the laser beam and the associated introduction of thermal energy
Implementation Method 3
Both laser ablation processes are referred to in the present application as scribing (introduction of a scribing line into the ceramic-metal substrate) or as cutting (complete cutting through of the ceramic-metal substrate)
Data Source
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AI summary
Disclosed is a ceramic-metal substrate comprising a ceramic substrate and on at least one side of the ceramic substrate a metallization, characterized in that the ceramic-metal substrate has at least one scribing line and/or cutting edge, wherein amorphous phases extend parallel to the scribing line and/or the cutting edge in a width of at most 100 µm.