3D Printed Ceramic Structure With Embedded Metal Traces
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Solution Overview
Problem
Existing methods for fabricating ceramic articles with metallic elements, such as chip carriers, face challenges with interdiffusion between ceramic and metallic components during high-temperature firing, which degrades the properties of small-dimensional metallic elements, limiting the shapes and dimensions of accommodated metallic features.
Innovation Solution
A 3D printing method involving the formation of a ceramic body with embedded conductive traces, where a preceramic polymer resin is selectively cured and metallic particles are deposited in distinct regions, followed by pyrolysis in an inert atmosphere, allowing for the integration of metallic features with precise dimensions and materials like gold, silver, and copper within the ceramic matrix without interdiffusion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional high-temperature firing methods are used to fabricate ceramic articles with metallic elements, then the ceramic structure is formed, but interdiffusion occurs between ceramic and metallic elements which degrades the properties of small-dimensional metallic elements
Solution Approach 1:
The patent employs an inert atmosphere (nitrogen or argon) during the firing process to prevent interdiffusion and oxidation between the ceramic matrix and metallic elements. This inert environment maintains the integrity of small-dimensional metallic features by eliminating chemical reactions that would otherwise occur during high-temperature processing.
Solution Approach 2:
The patent modifies processing parameters by using lower firing temperatures (below the melting point of the metallic elements) and controlling the atmosphere composition. These parameter changes prevent interdiffusion while still achieving proper ceramic sintering and metallization, thereby preserving the properties of small-dimensional metallic features.
2Stability of the object's composition
If high-temperature firing is used to form the ceramic structure, then the ceramic particles are sintered, but the metallic elements with small dimensions experience property degradation due to interdiffusion
Solution Approach 1:
The inert atmosphere prevents chemical interdiffusion at the ceramic-metal interface during firing, allowing the ceramic structure to form through sintering while the metallic elements maintain their dimensional accuracy and structural integrity without degradation.
Solution Approach 2:
The patent creates a composite structure where ceramic particles are embedded in a glass matrix with metallic elements distributed throughout. This composite approach allows the ceramic to be sintered at temperatures that form a stable structure while the glass matrix and inert atmosphere protect the metallic elements from interdiffusion and property degradation.
3Ease of manufacture
If conventional fabrication methods are used, then ceramic chip carriers can be produced, but the shapes and dimensions of metallic elements are constrained
Solution Approach 1:
The patent applies liquid metallization to the ceramic green body (unsintered state) before final firing. This preliminary action allows metallic elements to be deposited in complex shapes and precise dimensions that would be difficult to achieve through traditional wire wrapping or screen printing methods, while the subsequent inert atmosphere firing preserves these features.
Solution Approach 2:
By changing the metallization approach to liquid deposition and controlling the firing atmosphere, the patent enables greater versatility in metallic feature geometries. The process accommodates various shapes and dimensions including thin films, traces, and three-dimensional structures that were previously constrained by conventional fabrication limitations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the creation of ceramic articles with embedded metallic features that maintain their properties and integrity, allowing for precise routing of signals and power, heat management, and hermetic sealing without the degradation issues associated with traditional methods.
Implementation Method 1
a preceramic polymer resin is selectively cured
Implementation Method 2
followed by pyrolysis in an inert atmosphere
Data Source
AI summary
A ceramic article. In some embodiments, the ceramic article includes a ceramic body composed of a ceramic material; and a first conductive trace, the first conductive trace having a first portion entirely within the ceramic material, the first portion having a length of 0.5 mm and transverse dimensions less than 500 microns, the ceramic material including a plurality of ceramic particles in a ceramic matrix.