Ceramic Metallization Composition for Adhesion Without Base Body Damage

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Solution Overview

Problem

Ceramic components with metallizations face issues where the composition of the metallizations can negatively affect the ceramic base body, leading to adhesion problems and potential interactions that impact the component's performance and production costs.

Innovation Solution

A ceramic component with a metallization comprising lithium vanadium phosphate and copper, optionally with glass, applied to the outer surface, ensuring electrical conductivity and adhesion without harming the ceramic base body, and a manufacturing method involving sintering and affixing a metal-containing paste to create the metallization, which reduces production costs by eliminating an additional burning step.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional metallization compositions are used, then electrical conductivity can be achieved, but adhesion to the ceramic base body deteriorates and negative interactions occur

Engineering Contradiction:
Improveadhesion of metallizationVSAvoidnegative interaction with ceramic base body
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The metallization uses a composite material consisting of copper particles, lithium vanadium phosphate glass powder, and organic vehicle. This composite formulation allows the glass component to chemically bond with the ceramic base body while the copper provides electrical conductivity, thereby achieving both strong adhesion and electrical functionality without negative interactions.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

Lithium vanadium phosphate glass acts as an intermediary substance between the copper metallization and the ceramic base body. The glass component facilitates chemical bonding to the ceramic surface while being compatible with both materials, preventing negative interactions and ensuring stable adhesion during sintering and operation.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If additional burning step is added to create metallization, then adhesion improves, but production time and complexity increase

Engineering Contradiction:
Improveadhesion of metallizationVSAvoidproduction time
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent merges the metallization creation process with the sintering process into a single step. The green body with affixed metal-containing paste is sintered directly to form both the ceramic component and the metallization simultaneously, eliminating the need for a separate burning step and reducing production time while maintaining adhesion quality.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The metal-containing paste is affixed to the green body before sintering, preparing the metallization layer in advance. This preliminary action allows the metallization to be formed during the mandatory sintering process, avoiding additional processing steps and streamlining production.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides a metallization with optimal composition for ceramic components, ensuring reliable adhesion and electrical conductivity, allowing integration into electronic parts and reducing production costs by simplifying the manufacturing process while avoiding negative interactions with the ceramic base body.

Implementation Method 1

The amount of lithium vanadium phosphate in the metallization additionally guarantees sufficient adhesion of the metallization to the ceramic base body

Methodology Applied
Scientific EffectChemical bonding: Chemical Bonding

Implementation Method 2

The amount of copper in the metallization guarantees electric conductivity of the metallization

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 3

sintering of the green body in order to obtain a ceramic base body which has a metallization on an outer surface

Methodology Applied
Scientific EffectSintering: Sintering

Data Source

PatentUS11916236B2Ceramic component and method for manufacturing the ceramic component
Publication Date: 2024.02.27 TDK ELECTRONICS AG
  • US11916236B2 patent drawing

AI summary

A ceramic component and a method for manufacturing a ceramic component are disclosed. In an embodiment a ceramic component includes a ceramic base body and at least one metallization located an outer surface of the ceramic base body, wherein the metallization contains lithium vanadium phosphate having the general chemical formula LixVy(PO4)z, copper and glass, wherein a is a proportion of copper, b is a proportion of lithium vanadium phosphate and c is a proportion of glass which is contained in the metallization, wherein the following applies: 40 wt. %≤a≤99 wt. %, 1 wt. %≤b≤30 wt. %, 0 wt. %≤c≤20 wt. %, wherein x is a proportion of lithium, y is a proportion of vanadium and z is a proportion of phosphate in lithium vanadium phosphate, and wherein the following applies: 0<x, 0<y, 0<z.