Ceramic Power Module Spacers for Heat and Vibration Reliability
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Solution Overview
Problem
Power modules used in hybrid and electric vehicles face challenges in achieving high strength, efficient heat dissipation, and reliable bonding due to the high voltage and vibration generated by silicon carbide or gallium nitride semiconductor chips, which can lead to increased heat and mechanical stress.
Innovation Solution
A power module design featuring a duplex structure of ceramic substrates with spacers bonded using specific materials and processes, including insulating and conductive spacers, to maintain a consistent interval between substrates, enhance heat dissipation, and improve bonding reliability, thereby reducing the current path and improving efficiency and performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a double-sided cooling power module with high voltage and current is used to drive motors, then heat dissipation performance is improved, but high heat generation and vibration occur during driving
Solution Approach 1:
The module is divided into two separate substrates (first substrate and second substrate) with the semiconductor chip mounted between them. This segmentation allows independent optimization of each substrate for heat dissipation and mechanical stability, resolving the contradiction between high heat dissipation performance and high heat generation during driving
Solution Approach 2:
The semiconductor chip is nested between the two substrates, with the first substrate providing heat dissipation functionality and the second substrate providing mechanical support and vibration resistance. This nested structure allows both functions to coexist and resolve the contradiction between heat dissipation and vibration control
2Reliability
If ceramic substrates are used to achieve high strength and heat dissipation, then bonding reliability improves, but maintaining consistent intervals between substrates becomes difficult
Solution Approach 1:
A spacer is introduced as an intermediary element between the first substrate and second substrate. This spacer maintains a consistent interval between the substrates, ensuring manufacturing precision while allowing the use of high-strength ceramic materials for heat dissipation and bonding reliability
3Power
If a high-output power semiconductor chip is mounted between two substrates, then power output is improved, but the volume of current paths increases
Solution Approach 1:
The current paths are arranged in a planar configuration on the substrates rather than extending vertically through thick layers. This two-dimensional layout minimizes the volume occupied by current paths while still supporting high-output power semiconductor chips, resolving the contradiction between power output and current path volume
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides high strength, efficient heat dissipation, and enhanced bonding reliability, reducing electrical losses and mechanical stress, leading to improved performance and lifespan of the power module by maintaining a consistent interval between ceramic substrates and facilitating rapid heat transfer.
Implementation Method 1
a first bonding layer configured to bond the one end of the spacer to the lower ceramic substrate
Implementation Method 2
a second bonding layer configured to bond the other end of the spacer to the upper ceramic substrate
Implementation Method 3
configured to have one end bonded to the lower ceramic substrate and have the other end opposite to the one end bonded to the upper ceramic substrate
Implementation Method 4
The use of the double-sided cooling power module has more excellent cooling performance
Data Source
AI summary
The present invention relates to a power module and a method for manufacturing same, the power module including: a lower ceramic substrate; an upper ceramic substrate which is disposed spaced apart from the upper portion of the lower ceramic substrate, and on the lower surface of which a semiconductor chip is mounted; spacers each having one end bonded to the lower ceramic substrate and the other end bonded to the upper ceramic substrate; first bonding layers each bonding the one end of each spacer to the lower ceramic substrate; and second bonding layers each bonding the other end of each spacer to the upper ceramic substrate. The present invention maintains a constant distance between the lower ceramic substrate and the upper ceramic substrate by having the spacers arranged therebetween, and thus is advantageous in that the semiconductor chip can be protected and heat dissipation efficiency can be increased.