Optically Absorptive Ceramic Mount for Laser Soldering
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Accurate and reliable positioning of optical components in systems like fiber-coupled laser modules is challenging due to difficulties in attaching components to substrates using conventional mounts, especially when using light sources for soldering, as optically non-absorptive ceramic materials can burn when heated, limiting their applicability.
Innovation Solution
A ceramic mount optimized for soldering using a light source, composed of an optically absorptive material with varying thermal conductivity that is higher at the solder's melting point than at the component's operating temperature, preventing burning and ensuring efficient solder melting during assembly while minimizing heat dissipation during operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If an optically non-absorptive ceramic material is used for the mount, then the mount can be used for various ceramic applications, but the mount burns when heated by light from a laser during soldering
Solution Approach 1:
The patent changes the optical parameter of the ceramic material from non-absorptive to absorptive, enabling the mount to absorb light energy during soldering without burning. This parameter change resolves the contradiction by allowing the same ceramic material to be used reliably with laser-based soldering processes while maintaining its versatility for various ceramic applications.
Solution Approach 2:
The patent applies color changes by selecting ceramic materials with specific optical absorption characteristics. The optically absorptive ceramic material appears darker or has different optical properties compared to non-absorptive materials, enabling it to absorb laser energy effectively during soldering while preventing burning and maintaining structural integrity.
2Manufacturing precision
If a light source is used to melt solder for attaching components to the mount, then soldering can be performed precisely, but the optically non-absorptive ceramic mount burns due to insufficient heat absorption
Solution Approach 1:
The patent changes the optical absorption parameter of the ceramic mount material to enable effective heat absorption from the light source during soldering. This parameter change ensures that the mount absorbs sufficient energy to prevent burning while allowing precise soldering operations to be performed using the light source.
Solution Approach 2:
The patent converts the previously harmful effect of light absorption (which caused burning in non-absorptive materials) into a beneficial effect. By selecting optically absorptive ceramic materials, the mount now beneficially absorbs light energy to prevent burning while enabling precise soldering, transforming the potential harm into a useful property.
3Temperature
If ceramic material with low thermal conductivity is used for the mount, then heat is retained during soldering facilitating melting, but the material burns easily when heated by light source
Solution Approach 1:
The patent changes the optical properties of the ceramic material rather than the thermal conductivity. By selecting optically absorptive ceramic materials, the mount effectively absorbs light energy during soldering, preventing burning while maintaining appropriate heat retention characteristics. This parameter change in optical properties resolves the contradiction without requiring changes to thermal conductivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables reliable and efficient attachment of optical components by preventing burning of the mount and maintaining solder integrity, allowing for a wide range of thermal conductivity materials to be used, thereby enhancing the reliability and efficiency of the component assembly.
Implementation Method 1
the ceramic material is optically absorptive to enable the mount to be heated by light from the light source during soldering
Implementation Method 2
the ceramic material has a first thermal conductivity at an operating temperature of the component and a second thermal conductivity at a melting point of the solder
Implementation Method 3
aiding to melt the solder used to attach the component to the mount
Data Source
AI summary
The present invention relates to a component assembly and to a method of fabricating such a component assembly. The component assembly includes a substrate, a mount attached to the substrate, and a component attached to the mount with solder by melting the solder with light from a light source. The mount is composed of a ceramic material having properties advantageous for soldering using a light source. As a first property, the ceramic material is optically absorptive to enable the mount to be heated by the light from the light source. As a second property, the ceramic material has a first thermal conductivity at an operating temperature of the component and a second thermal conductivity at a melting point of the solder, the second thermal conductivity being at least 25% lower than the first thermal conductivity.