Multilayer Ceramic Mounting Structure for Stable Electrode Placement
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Solution Overview
Problem
The downsizing of multilayer ceramic electronic components leads to unstable mounting postures due to the absence of external electrodes on end surfaces, resulting in floating or tilting during the mounting process, which is exacerbated by the reduction in stability.
Innovation Solution
The external electrodes are placed on the main surfaces of multilayer ceramic electronic components, with specific positioning and dimensions to ensure stable mounting, including the first and second external electrodes being spaced apart in the length direction and connected to land electrodes on the circuit board, where the inner edges of the external electrodes are closer to the land electrodes than the outer edges, enhancing the contact area and stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If external electrodes are removed from end surfaces to enable downsizing, then component size is reduced, but mounting posture stability deteriorates
Solution Approach 1:
The patent relocates external electrodes from the end surfaces (length direction) to the main mounting surfaces (width direction) of the multilayer body. This dimensional relocation allows the electrodes to be positioned on the top and bottom surfaces where they can form effective solder connections with land electrodes, while maintaining a compact length dimension for downsizing. The electrode positioning in the width direction creates sufficient contact area for stable mounting without requiring end surface electrodes.
2Device complexity
If external electrodes are positioned on main surfaces only, then manufacturing complexity is reduced, but mounting stability deteriorates without proper electrode positioning
Solution Approach 1:
The patent applies local quality by creating an asymmetric electrode configuration where the first external electrode extends further in the length direction than the second external electrode. Specifically, the first external electrode's inner edge is positioned closer to the first land electrode than the second external electrode's inner edge is to the second land electrode. This non-uniform positioning optimizes the solder fillet formation and mounting stability for each electrode pair, compensating for the absence of end surface electrodes.
3Productivity
If paste solder fillet area is reduced for high-density mounting, then mounting density is improved, but mounting posture stability deteriorates
Solution Approach 1:
The patent shifts the primary solder connection area from the end surfaces (length direction) to the main mounting surfaces (width direction). By positioning external electrodes on the top and bottom surfaces with appropriate extensions in the length direction, the solder fillets are formed primarily in the width direction where they can provide sufficient bonding area for stable mounting. This allows for reduced overall fillet volume while maintaining stability, enabling high-density mounting arrangements.
Data Source
AI summary
A layered ceramic electronic component mounting structure includes a layered ceramic electronic component mounted on a circuit board. The layered ceramic electronic component includes a layered body including an inner conductor layer and dielectric layers, and first and second outer electrodes located on only two principal surfaces or on only one principal surface of the layered body. The circuit board includes first and second land electrodes. An inside end of the first outer electrode is closer to the second outer electrode and the second land electrode than an inside end of the first land electrode, and an inside end of the second outer electrode is closer to the first outer electrode and the first land electrode than an inside end of the second land electrode.