Integrated Ceramic Mounting Package for Low Thermal Resistance
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Solution Overview
Problem
Conventional electrical element mounting packages have low heat dissipation performance due to high thermal resistance at the interfaces between the submount and joint material, and between the joint material and the metal base, which hinders effective heat transfer from the submount to the metal base.
Innovation Solution
An electrical element mounting package with a plate-like ceramic substrate and a protruding ceramic base, where the substrate and base are made integrally without a joint material like solder, and include side conductors and via conductors to reduce thermal resistance and enhance heat transfer, utilizing high thermal conductivity materials such as aluminum nitride and metalized films for improved heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a submount and joint material are used to connect the electrical element to the metal base, then the electrical element can be mounted and electrically connected, but the thermal resistance increases and heat dissipation performance deteriorates
Solution Approach 1:
The patent removes the joint material layer from the conventional structure, directly bonding the ceramic submount to the metal base through sintering. This extraction of the thermal barrier (joint material) eliminates the additional thermal resistance interface while maintaining electrical connection reliability through the integrated ceramic structure.
Solution Approach 2:
The patent merges the submount and base into a single integrated ceramic structure through sintering, where the submount protrudes from the base as one piece. This merging eliminates the interface between submount and joint material, creating a continuous thermal path from the electrical element through the ceramic to the metal base.
2Ease of manufacture
If joint material like solder is used to fix the submount to the metal base, then the components can be assembled, but the thermal resistance at the interface increases
Solution Approach 1:
The patent changes the bonding method from low-temperature soldering to high-temperature sintering, which creates a direct ceramic-to-metal bond without intermediate joint material. This parameter change in bonding temperature and method eliminates the thermal resistance of the joint material while maintaining manufacturing feasibility through established sintering processes.
3Reliability
If multiple layers including insulating members and buffer members are used to fix lead pins, then the electrical connections are reliable, but the device complexity increases
Solution Approach 1:
The patent makes the ceramic base perform multiple functions: it serves as the submount for mounting electrical elements, as the insulating structure for lead pin fixation, and as the thermal management component. This multi-functionality eliminates the need for separate insulating members and buffer members, reducing structural complexity while maintaining reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves high heat dissipation performance by minimizing thermal resistance and eliminating the need for joint materials, resulting in efficient heat transfer and reduced manufacturing costs while maintaining reliability and durability.
Implementation Method 1
the substrate and the base are made of ceramics integrally... utilizing high thermal conductivity materials such as aluminum nitride... for improved heat dissipation
Data Source
Figure 1A~1C
Figure 2A~2C
Figure 3A~3B
AI summary
An electrical element mounting package includes a plate-like substrate (10) and at least one base (11) that protrudes from a front surface (10a) of the substrate (10) and has a mounting surface (11a) on which an electrical element is mounted, wherein the substrate (10) and the base (11) are made of ceramics integrally. The electrical element mounting package includes an element terminal (12a) that is provided on the mounting surface (11a) of the base (11), a side conductor (13) that is provided on a side surface (11b) of the base (11) and extends in a thickness direction of the base (11), and a substrate-side via conductor (15a) that is provided inside the substrate (10) and extends in a thickness direction of the substrate (10), wherein the element terminal (12a), the side conductor (13), and the substrate-side via conductor (15a) are connected to one another.