Ceramic Mounting Substrate for Self-Alignment and Heat Dissipation
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Solution Overview
Problem
Existing mounting substrates face challenges in easily disposing electronic components due to the movement of electrically-conductive bonding materials on metal surfaces, making self-alignment and thickness control difficult, and they lack effective heat dissipation properties.
Innovation Solution
A mounting substrate design featuring a ceramic substrate with through holes or recesses containing metal members and a bonding material, where the metal members' surfaces are exposed and surrounded by the ceramic, along with a bonding material that includes active metal brazing with ceramic particles to minimize expansion differences and improve heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If bonding material is applied on metal surface, then electronic component can be mounted, but bonding material moves on metal surface making self-alignment and thickness control difficult
Solution Approach 1:
The patent applies different surface properties to different regions: the ceramic substrate provides a rough, high-friction surface for bonding material adhesion, while the metal protrusion provides a flat, stable mounting surface. This local differentiation prevents bonding material movement while enabling precise component placement.
Solution Approach 2:
The ceramic substrate acts as an intermediary between the metal protrusion and the bonding material. The bonding material is applied on the ceramic surface rather than directly on metal, preventing material movement while maintaining strong adhesion through the ceramic intermediary layer.
2Temperature
If metal member is embedded in ceramic substrate, then heat dissipation is improved, but expansion difference between ceramic and metal causes cracks
Solution Approach 1:
The patent explicitly addresses thermal expansion differences between ceramic and metal by designing the metal member to protrude from the ceramic substrate. This configuration allows the metal to expand independently without constraining the ceramic, preventing crack formation while maintaining effective heat dissipation through the metal protrusion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables easy self-alignment and thickness control of electronic components, enhances heat dissipation, and reduces the likelihood of cracks by minimizing expansion differences between ceramic and metal components.
Implementation Method 1
a bonding material disposed between the ceramic substrate and each of the metal members in the through holes, and configured to bond the ceramic substrate to the metal members
Implementation Method 2
sintering the bonding material disposed in the through holes or in the recesses of the ceramic substrate
Data Source
AI summary
A mounting substrate includes a ceramic substrate having two or more through holes, metal members disposed in respective through holes, and a bonding material disposed between the ceramic substrate and each of the metal members in the through holes. A portion of an upper surface, a portion of a lower surface, and a portion of lateral surfaces of each of the metal members are exposed through the ceramic substrate. The portion of the lateral surfaces and the portion of the lower surface of each of the metal members, exposed through the ceramic substrate, are continuous with each other. The portion of the lateral surfaces of each of the metal members, exposed through the ceramic substrate, is coplanar with a lateral surface of the ceramic substrate. The ceramic substrate is disposed so as to surround an outer periphery of each of the metal members in a top view.