Ceramic Multilayer Component Via Hole Protrusion Control
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Solution Overview
Problem
Ceramic multilayer components face issues with achieving a high degree of flatness on their mounting surface due to protrusion of via hole conductors during firing, especially when the distance between these conductors is reduced to minimize component size, leading to insufficient flatness and potential shorts between terminal electrodes.
Innovation Solution
Incorporating an insulating portion made of a ceramic-based material, such as BAS, that extends across the surface and covers portions of the via hole conductors and terminal electrodes, preventing protrusion by forming a fixed wall around the via hole conductors during firing, thus maintaining a flat mounting surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the distance between adjacent via hole conductors is made smaller to decrease the size of the ceramic multilayer component, then the component size is reduced, but the degree of protruding of the via hole conductors caused by firing becomes larger and the mounting surface flatness deteriorates
Solution Approach 1:
An insulating portion is introduced as an intermediary element between the via hole conductors and the terminal electrodes. This insulating portion prevents direct contact between the via hole conductors and terminal electrodes, thereby preventing shorts while allowing the via hole conductors to be positioned closer together. The insulating portion acts as a mediator that resolves the conflict between reducing component size and maintaining mounting surface flatness.
Solution Approach 2:
The invention changes the structural parameters of the component by adding the insulating portion that extends from the ceramic multilayer body surface to cover the via hole conductors. This parameter change (adding the insulating structure) allows the via hole conductors to be positioned closer together without causing shorts, thereby enabling size reduction while maintaining flatness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures a high degree of flatness on the mounting surface, enhancing mountability, contact reliability, and transportability by preventing via hole conductor protrusion and controlling the distance between terminal electrodes effectively.
Implementation Method 1
An insulating portion is arranged to extend as a single body across a surface of the ceramic multilayer body and across a surface of the terminal electrode. The insulating portion covers at least a portion of the via hole conductor
Data Source
AI summary
A ceramic multilayer component includes a ceramic body including a plurality of ceramic layers stacked on top of one another, internal electrodes located inside the ceramic multilayer body, terminal electrodes located on a mounting surface of the ceramic multilayer body, and via hole conductors that are arranged inside the ceramic multilayer body so as to connect the internal electrodes and the terminal electrodes to each other. An insulating portion is arranged to extend as a single body across a surface of the ceramic multilayer body and across the terminal electrodes. The insulating portion covers at least a portion of each of the via conductors and covers a portion of each of the terminal electrodes when viewed from the mounting surface side.