Ceramic Optical Module Support Block for Heat and 40 GHz Signals
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Solution Overview
Problem
Existing small optical modules face challenges in improving heat dissipation and high-frequency characteristics, particularly due to limitations in thermal conductivity of support blocks and processing difficulties in forming metal films on ceramic surfaces.
Innovation Solution
The optical module incorporates a ceramic support block with a metallization pattern on its surface, including first metal films on specific surfaces, a connection conductor for electrical continuity, and a thermoelectric cooler for enhanced heat management, thereby improving both heat dissipation and high-frequency characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a support block made of the same material as the eyelet is used, then the processing is easier, but the thermal conductivity is poor
Solution Approach 1:
The support block is constructed as a composite structure combining a ceramic body (aluminum nitride) with a metal film (gold) formed on its surface. The ceramic provides excellent thermal conductivity for heat dissipation, while the metal film ensures electrical continuity and improves high-frequency characteristics. This composite approach resolves the contradiction by integrating materials with complementary properties.
2Temperature
If a support block made of aluminum nitride is used, then the thermal conductivity is improved, but it is difficult to form a metal film on the entire surface
Solution Approach 1:
Instead of forming metal films on the entire surface of the aluminum nitride support block, the invention applies metal films only on specific surfaces where electrical connection is required. The metallization pattern is selectively formed on the first surfaces and second surfaces of the ceramic body, reducing processing difficulty while maintaining thermal conductivity performance.
3Ease of manufacture
If a metal film is formed only on part of the support block, then the processing is easier, but the high-frequency characteristics are inferior
Solution Approach 1:
The invention introduces a connection conductor (via conductor or castellation conductor) as an intermediary element that bridges the metallization pattern on different surfaces of the ceramic body. This connection conductor ensures electrical continuity through the support block, improving high-frequency characteristics while maintaining the advantage of selective metallization that simplifies processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively enhances heat dissipation using the ceramic body and improves high-frequency characteristics by ensuring electrical continuity through the metallization pattern and connection conductor, enabling reliable transmission beyond 40 GHz.
Implementation Method 1
Heat dissipation can be improved by the ceramic body
Implementation Method 2
high-frequency characteristics can be improved by electrical continuity of the pair of first metal film through the connection conductor
Implementation Method 3
a photoelectric device configured to convert an optical signal and an electrical signal from at least one to another
Data Source
AI summary
The metallization pattern includes a pair of first metal films on the respective pair of first surfaces, and a second metal film on the pair of second surfaces to connect the pair of first metal films. The support block includes a connection conductor connecting the pair of first metal films, the connection conductor being a castellation conductor and/or a via conductor, the castellation conductor being on the pair of third surfaces of the ceramic body, the via conductor being through the ceramic body between the pair of first surfaces. The mounting substrate is mounted on one of the pair of first surfaces. One end of the first wire is bonded to a corresponding one of the pair of first metal films or the connection conductor, at a position adjacent to or overlapping with the connection conductor, on another of the pair of first surfaces.