Ceramic Electronic Component Oxide Roughening for Resin Adhesion
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Solution Overview
Problem
Ceramic electronic components sealed with resin often experience poor adhesion between the ceramic component and the resin, leading to gaps that allow moisture ingress, reducing reliability and performance.
Innovation Solution
A ceramic electronic component design featuring external electrodes with a base layer and plating layer on multiple surfaces, including a metal-containing base layer and oxide layer on the upper surface, where the oxide layer has a surface roughness of 0.20 micrometers or greater, enhancing adhesion with sealing resin and preventing moisture ingress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a dummy block is pressed against the lower surface of the element body to prevent terminal electrodes from being formed on the lower surface, then the terminal electrodes are properly positioned on the side surfaces, but the lower surface of the element body becomes flattened, reducing adhesion with sealing resin
Solution Approach 1:
The invention applies a roughening treatment specifically to the lower surface of the element body, creating localized surface roughness (Ra: 0.2 µm or more) only where needed for adhesion. This allows the lower surface to maintain high adhesion properties while the side surfaces remain smooth for proper terminal electrode formation, resolving the contradiction between manufacturing precision and reliability.
2Reliability
If the lower surface of the element body is kept smooth for good adhesion with sealing resin, then adhesion is improved, but terminal electrodes cannot be properly formed on the side surfaces without flattening the lower surface
Solution Approach 1:
The invention differentiates the surface properties of different regions: the lower surface is roughened to enhance adhesion with sealing resin, while the side surfaces maintain smoothness for proper terminal electrode formation. This localized quality differentiation resolves the contradiction by assigning different surface characteristics to different functional areas.
Solution Approach 2:
The roughening treatment is applied to the lower surface in advance, before the sealing resin is applied. This preliminary action ensures that the surface is pre-prepared with optimal adhesion properties, preventing the need to compromise surface smoothness during subsequent manufacturing steps.
3Reliability
If the oxide layer surface roughness is increased to improve adhesion with sealing resin, then adhesion strength increases, but the surface becomes less smooth
Solution Approach 1:
The invention applies surface roughening specifically to the lower surface where adhesion is critical, while maintaining smooth surfaces on the side surfaces where terminal electrodes are formed. This localized application of roughness resolves the contradiction by making the surface property change only where it provides functional benefit.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves adhesiveness between the ceramic component and sealing resin, preventing gaps and enhancing the reliability of resin-encapsulated ceramic components by ensuring better contact and sealing.
Implementation Method 1
the oxide layer having a surface roughness Ra that is equal to or greater than 0.20 micrometers... improves the adhesiveness with sealing resin
Data Source
AI summary
A ceramic electronic component includes an element body having a dielectric and internal electrodes, the element body having an upper surface, a lower surface, and side surfaces; external electrodes formed on multiple surfaces of the element body, and an oxide layer formed on the upper surface of the element body. Each of the external electrodes has a base layer and a plating layer, the base layer containing metal and having a lower part formed on the lower surface of the element body and a side part formed on one of the side surfaces of the element body and being connected to one or more of the internal electrodes, the plating layers being formed on the lower part of the corresponding base layer. The oxide layer has a surface roughness Ra that is equal to or greater than 0.20 micrometers.