Ceramic Package Brazing Joint Melting Suppression
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Ceramic packages experience metal component melting at joint portions in high-temperature and high-humidity environments, leading to deterioration of electrical characteristics and appearance due to inadequate suppression of brazed joint degradation.
Innovation Solution
A ceramic package design incorporating a ceramic substrate with a metallization layer, a plating layer, and a brazing material layer, where the brazing material layer's ends are positioned outside the seal member's region, and the plating layers have specific thicknesses to enhance joining strength and prevent metal component melting, along with a production method involving metallization, plating, and heating steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If brazing is performed for joining metal materials in a ceramic package, then joining strength is improved, but metal component melting occurs at joint portions in high-temperature and high-humidity environments
Solution Approach 1:
The patent introduces a plating layer as an intermediary between the metallization layer and the brazing material layer. This plating layer acts as a protective barrier that prevents direct contact and potential melting between the metallization layer and brazing material layer in high-temperature and high-humidity environments, while still allowing effective joining to occur.
Solution Approach 2:
The patent creates a composite structure consisting of multiple layers: metallization layer, plating layer, and brazing material layer. This composite material approach combines the advantages of each layer - the metallization layer provides base adhesion, the plating layer provides protection against melting, and the brazing material layer provides joining strength - to achieve both strong joining and resistance to thermal degradation.
2Strength
If the brazing material layer is positioned close to the seal member, then joining strength is improved, but metal component melting and deterioration of electrical characteristics occur
Solution Approach 1:
The plating layer serves as a protective intermediary that allows the brazing material layer to be positioned close to the seal member for strong joining while preventing the harmful melting and electrical deterioration by blocking direct interaction between the metallization layer and environmental factors.
Solution Approach 2:
The plating layer is applied in advance before brazing, creating a protective cushion or barrier that prevents future melting and electrical characteristic deterioration. This prior protective measure ensures that even when the brazing material layer is close to the seal member, the underlying metallization layer remains protected from thermal and environmental damage.
3Reliability
If a plating layer with specific thickness is applied between the metallization layer and brazing material layer, then resistance to metal component melting is improved, but device complexity increases
Solution Approach 1:
The patent optimizes the thickness parameter of the plating layer to achieve the desired protection against metal component melting. By carefully controlling the thickness within a specific range, the patent achieves effective protection while minimizing the increase in device complexity. This parameter optimization allows the additional layer to provide maximum benefit with minimal added complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively suppresses metal component melting and deterioration of electrical characteristics and appearance, maintaining insulation properties and joining strength even in harsh environments.
Implementation Method 1
a metallic seal ring is brazed to a ceramic substrate. The seal ring is a seal member for hermitically joining a metal lid
Implementation Method 2
a metal component partially melts out at a joint portion of a brazed seal member in a high-temperature and high-humidity environment. The (first) plating layer may have a thickness of not less than 1.5 μm and not greater than 5 μm at least at a portion interposed between the metallization layer and the brazing material layer
Data Source
AI summary
A ceramic package includes a ceramic substrate, a metallization layer, a first plating layer, a brazing material layer, and a seal member. The ceramic substrate has a surface, and the metallization layer is disposed along an outer periphery of a predetermined region on the surface. The first plating layer is disposed on the metallization layer. The brazing material layer is disposed on the metallization layer with the first plating layer interposed therebetween. The seal member is joined on the metallization layer via the brazing material layer. In at least one of an outer peripheral portion and an inner peripheral portion of the brazing material layer, an end of the brazing material layer is located outside a region directly below the seal member and the end of the brazing material layer is positioned nearer to the seal member than an end of the metallization layer.