Ceramic Package Frame Segmentation for Lower-Cost DC Lead Routing
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Solution Overview
Problem
The high-frequency signal device package for CDM requires a significantly higher number of ceramic layers due to doubled DC lead pins on one side, leading to increased costs compared to ICR packages, as the number of conductor layers and insulator layers is almost twice as large, making cost reduction difficult.
Innovation Solution
A manufacturing method involving a first frame with an L-shape structure that includes stacked conductor and insulating layers, combined with a second frame and a base material to form a package, reducing the multilayer structure to only the first frame portion, thereby lowering production costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If all DC lead pins are arranged on one side to wire DC lines connected to the 40 DC lead pins independently by conductor layers that form a ceramic package housing, then the electrical connection is achieved, but the number of conductor layers and insulator layers increases to almost twice, leading to increased cost
Solution Approach 1:
The package housing is divided into a first housing and a second housing. The first housing contains the multilayer structure with conductor layers and insulator layers for wiring DC lines to DC lead pins arranged on one side. The second housing contains only DC lead pins without the multilayer structure. This segmentation allows the complex multilayer structure to be localized only where needed, reducing the overall number of layers and cost while maintaining electrical connection functionality.
2Reliability
If the number of stacked layers of insulator is increased to accommodate 40 DC lead pins on one side, then the electrical connection capability is improved, but the manufacturing cost increases significantly
Solution Approach 1:
The package housing is segmented into a first housing with the multilayer structure for electrical connections and a second housing without it. This allows the complex multilayer structure to be localized only where DC lead pins require wiring, reducing material usage and manufacturing cost while maintaining the necessary electrical connection capability for all 40 DC lead pins.
Solution Approach 2:
The multilayer structure with conductor and insulator layers is applied locally only to the first housing where DC lead pins are arranged on one side and require independent wiring. The second housing, which contains DC lead pins that do not require the same wiring complexity, omits this structure. This local application of the multilayer structure reduces overall material usage and manufacturing cost while maintaining electrical connection reliability where needed.
Data Source
Figure 1A~1B
Figure 1C~1D
Figure 1E~1F
AI summary
A first frame (101) includes portions of a first short side surface (101a) and a first long side surface (101b), in which a plurality of conductor layers to which a plurality of DC electrode terminals (109) are connected, and a plurality of insulating layers arranged between the plurality of conductor layers are stacked. On the other hand, a second frame (105) includes portions of a second short side surface (105a) and a second long side surface (105b), and does not have a stacked structure of conductor layers and the like.