Ceramic Package GND Line Prevents Sealant Contact
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Solution Overview
Problem
Conventional electronic component packages face malfunctions due to the sealing member spreading and contacting electronic component elements, leading to reduced bonding strength and airtightness, as the melted sealing member can overflow onto GND line patterns and electronic components.
Innovation Solution
The electronic component package design includes a base with a bottom portion and wall portion forming a cavity, featuring electrode pads, external terminals, and line patterns, with a connecting portion between the layers to prevent the sealing member from spreading and contacting the electronic components, ensuring internal clearance and maintaining bonding integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the base and lid are bonded together with a sealing member by heat-melting, then hermetic sealing is achieved, but the melted sealing member may spread beyond the sealing portion and contact electronic component elements causing malfunction
Solution Approach 1:
The patent introduces a GND line pattern as an intermediary barrier between the sealing member and electronic component elements. The GND line pattern is positioned to intercept the spreading sealing member before it can contact the electronic components, thus protecting them from harmful contact while maintaining the hermetic sealing function
Solution Approach 2:
The patent segments the base structure into multiple functional zones: a sealing portion for bonding, a GND line pattern region for electromagnetic shielding and sealing member interception, and an electronic component mounting area. This segmentation allows the sealing member to be contained and directed away from sensitive components
2Object-affected harmful factors
If the GND line pattern is formed on the base to ground the metal lid, then electromagnetic interference is reduced, but the sealing member may spread on the GND line pattern and reach electronic component elements
Solution Approach 1:
The GND line pattern serves as a dual-function intermediary: it provides electromagnetic shielding by grounding the metal lid while simultaneously acting as a physical barrier to intercept and contain the spreading sealing member, preventing it from reaching electronic component elements
Solution Approach 2:
The GND line pattern is designed to perform multiple functions simultaneously: electromagnetic shielding, grounding, and physical barrier against sealing member spread, thereby eliminating the need for separate protective structures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively prevents malfunctions by ensuring the sealing member does not contact the electronic components, maintaining required bonding strength and airtightness, while allowing for a reduced package size and improved electromagnetic interference countermeasures.
Implementation Method 1
The base and the metal lid are bonded together with a sealing member by heat-melting
Data Source
AI summary
In an electronic-component package made up of a laminated-ceramic, cavity-forming base and an electroconductive lid that is hermetically bonded to the base by a heat-melting sealant, contamination of electromagnetic-interference-reducing grounding metallization lines by melted sealant is prevented. A wall-portion grounding metallization line partially embedded in an enclosing wall portion of the base, and partially exposed to the package cavity, electrically connects lid, when sealant-bonded to the wall portion of the base, with a grounding external terminal on the base exterior. An electronic-component grounding metallization line exposed in the bottom of the base is connected to the grounding external terminal. A connecting portion that joins the wall-portion and electronic-component grounding metallization lines is disposed between laminations of the bottom and wall portions of the base, where the connecting portion is unexposed to the package cavity.