Ceramic Semiconductor Package Assembly for Stress-Buffered Production
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Solution Overview
Problem
Conventional H-shaped ceramic bases for crystal oscillators have complex manufacturing processes, high production costs, low efficiency, high rigidity, and unstable structures, leading to high unit prices, low profit margins, and short service lives due to mechanical stress and damage.
Innovation Solution
A semiconductor package structure comprising a ceramic base with a crystal sheet in a groove and a lower package body encapsulating a semiconductor chip and wiring layer, which can be produced separately and assembled, allowing batch production and reducing costs, while the second encapsulation layer acts as a buffer to mitigate mechanical and thermal stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If H-shaped ceramic base is used for crystal oscillator packaging, then the structure provides good mechanical support and electrical insulation, but the manufacturing process becomes complex and costly with low production efficiency
Solution Approach 1:
The packaging structure is divided into separate components: a ceramic base for the crystal oscillator and a separate lower package body for the semiconductor chip. These components are manufactured independently and then assembled together, allowing each part to be optimized and produced efficiently before combination.
Solution Approach 2:
The ceramic base and lower package body are merged into a single functional unit through assembly, combining the advantages of ceramic (insulation, stability) and plastic/molding materials (cost-effectiveness, manufacturing efficiency) while maintaining the structural integrity needed for mechanical support.
2Strength
If H-shaped ceramic base is used for crystal oscillator packaging, then the structure provides good mechanical support, but the production cost increases and profit margin decreases
Solution Approach 1:
By segmenting the packaging into a ceramic base and a separately manufactured lower package body, the expensive ceramic component is minimized to only where needed (base and groove area), while less expensive materials and processes are used for the remaining packaging structure.
Solution Approach 2:
The lower package body uses cost-effective molding materials and processes instead of expensive ceramic throughout, reducing overall production cost while maintaining sufficient mechanical support through the combined structure.
3Strength
If H-shaped ceramic base is used for crystal oscillator packaging, then the structure provides good mechanical support, but the rigidity is too high causing mechanical stress and damage
Solution Approach 1:
Dividing the packaging into ceramic and non-ceramic sections creates a structure with varying rigidity, allowing the ceramic base to provide local support where needed while the lower package body absorbs and distributes mechanical stress more flexibly.
Solution Approach 2:
Changing the material parameters from uniform high-rigidity ceramic to a combination of materials with different rigidity characteristics allows the structure to better accommodate thermal expansion and mechanical stress, reducing the risk of damage.
4Reliability
If H-shaped ceramic base is used for crystal oscillator packaging, then the structure provides good electrical insulation, but the manufacturing process complexity increases
Solution Approach 1:
The ceramic base is limited to only the portions requiring electrical insulation (base and groove area), while the lower package body uses standard molding processes, simplifying the overall manufacturing process while maintaining insulation where critical.
Data Source
AI summary
The present application discloses a semiconductor package structure and a packaging method. The semiconductor package structure includes a ceramic base and a lower package body. A crystal sheet is disposed in a groove at an upper surface of the ceramic base. The lower package body includes a first encapsulation layer which encapsulates a semiconductor chip and a second encapsulation layer which encapsulates a wiring layer. An active surface of the semiconductor chip is located inside the first encapsulation layer and is electrically coupled to the wiring layer. The ceramic base and the lower package body according to the present disclosure may be produced separately and then assembled. The package body may be produced in batches and then diced, which increases production efficiency and greatly reduces manufacturing costs. It also helps relieve mechanical stress, ensuring structural stability.