Ceramic Panel Exostructure Impact Absorption
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Solution Overview
Problem
There is a need for a package system with a novel cover structure that provides aesthetics, tactile qualities, and durability, as existing solutions have not effectively addressed these requirements in consumer electronics, particularly in handheld devices where ceramics are brittle and prone to damage.
Innovation Solution
A package system comprising a non-ceramic exostructure with ceramic panels attached, where the exostructure protrudes beyond the ceramic panel in all directions to absorb impact and distribute stress, combining the aesthetic and tactile benefits of ceramics with the structural integrity of non-ceramic materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If ceramic materials are used for the cover structure, then aesthetic and tactile qualities are improved, but durability and drop reliability deteriorate due to brittleness
Solution Approach 1:
The patent applies composite materials by combining ceramic cover structures with non-ceramic structural components. The device housing includes both ceramic portions (providing aesthetic and tactile qualities) and non-ceramic portions (providing structural support and impact resistance), creating a composite structure that leverages the advantages of both material types while mitigating their individual weaknesses.
2Shape
If ceramic materials are used for the cover structure, then aesthetic qualities are improved, but mechanical strength and impact resistance worsen
Solution Approach 1:
The patent segments the housing into distinct ceramic and non-ceramic portions. The ceramic segments provide aesthetic qualities while the non-ceramic segments provide structural strength and impact resistance. This segmentation allows each material to be used where it is most effective, avoiding the need to use ceramic throughout the entire housing structure.
3Shape
If a monolithic ceramic housing is used, then aesthetic and tactile qualities are improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The housing is segmented into separate ceramic and non-ceramic components that can be manufactured independently using different processes optimized for each material type, then assembled together. This reduces manufacturing complexity compared to creating a monolithic ceramic housing, as each component can be produced using the most suitable manufacturing method for its specific material requirements.
Data Source
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AI summary
A package system includes: an exostructure; a ceramic panel attached to the exostructure; and an internal device component housed in the exostructure.