Monolithic Ceramic Component Side Paste Application
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Solution Overview
Problem
Existing methods for manufacturing monolithic ceramic electronic components, such as capacitors, face challenges in reducing the dimensions of protective areas without increasing the risk of short-circuiting and dimensional variations, particularly due to uneven ceramic slurry application and surface tension issues.
Innovation Solution
A manufacturing method involving the preparation of ceramic green sheets with internal electrodes, cutting to form green chips or rod-shaped block bodies with exposed electrodes, applying a ceramic paste using a specialized application plate to ensure uniform coverage on cut side surfaces, and tumbling to create open surfaces for precise paste application, followed by firing to form protective layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the dimensions of the protective area at the side are reduced to increase the effective area of internal electrodes, then the capacitance increases, but the reliability decreases due to increased risk of short-circuiting
Solution Approach 1:
The patent applies different protective area dimensions to different locations: the protective area at the side (width direction) is reduced to increase effective electrode area and capacitance, while the protective area at the end (length direction) is maintained at a larger dimension to prevent short-circuiting between internal electrodes and external electrodes. This local differentiation resolves the contradiction by optimizing each area for its specific functional requirement.
2Ease of manufacture
If the ceramic slurry is applied by dipping to form the protective area, then the manufacturing process is simple, but the thickness uniformity deteriorates due to surface tension at corners
Solution Approach 1:
The patent introduces a protective film as an intermediary carrier that is applied to the laminate before dipping in ceramic slurry. This protective film mediates the slurry application process by providing a controlled surface that prevents direct surface tension effects at the laminate corners, enabling both simple dipping application and uniform thickness distribution. The protective film acts as a buffer between the slurry and the laminate surface.
3Volume of moving object
If the protective area dimensions are reduced to meet miniaturization requirements, then the component size decreases, but the dimensional stability deteriorates due to water entry from corners
Solution Approach 1:
The patent applies a protective film to the laminate surface before the ceramic slurry application step. This preliminary action of protecting the surface prevents water from entering at the corners during subsequent processing steps, thereby maintaining dimensional stability even when the protective area dimensions are reduced for miniaturization. The protective film is applied in advance to prevent the harmful effect of water intrusion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively reduces the risk of short-circuiting and dimensional variations by ensuring uniform ceramic paste application and retention, enhancing the reliability and consistency of monolithic ceramic electronic components.
Implementation Method 1
applying a ceramic paste to the cut side surface to form a raw ceramic protective layer
Implementation Method 2
the applying step further includes the step of tumbling the green chips in a state in which the green chips arrayed in the row and column directions are spaced apart from each other, to make the cut side surface of each of the green chips uniformly an open surface
Implementation Method 3
the step of firing the raw component body is performed
Data Source
AI summary
In a manufacturing method for a monolithic ceramic electronic component, a ceramic paste is applied by using an application plate to a side surface of each of a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block. In the applying step, the ceramic paste is transferred to the side surface by moving the green chips and the application plate relative to each other in the direction in which the side surface extends while separating the green chips from the application plate, in a state where the ceramic paste is connected to both the green chips and the application plate.