3D-Printed Ceramic PCBs with Infused Conductors
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Solution Overview
Problem
Conventional printed circuit boards (PCBs) face limitations in harsh conditions due to the use of low-melting point polymer resins and conductive inks, and sintered materials with micro-voids that lead to shortened lifespan under vibration or shock.
Innovation Solution
3D-printing ceramic substrates with infused electrically conductive materials into voids, allowing for high-melting point ceramics and conductive materials that maintain reliability across temperature extremes and mechanical stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If polymer resins and conductive inks are used to make PCBs, then the manufacturing process is simple and low-cost, but the PCBs cannot operate at temperatures exceeding the melting point or softening point of the materials
Solution Approach 1:
The patent changes the material parameters by replacing polymer resins with ceramic materials that have fundamentally different thermal properties. The ceramic substrate can withstand temperatures up to 350°C, dramatically expanding the operating temperature range while maintaining manufacturability through 3D printing processes.
Solution Approach 2:
The patent creates a composite structure combining ceramic substrate material with infused conductive materials. This composite approach allows the substrate to provide high-temperature stability while the infused conductive materials provide electrical functionality, resolving the contradiction between material temperature resistance and electrical conductivity.
2Temperature
If sintering is used to form electrical components and connections, then higher melting point conductive materials can be used, but the PCBs exhibit shortened lifespans when subject to vibration or shock due to micro-voids
Solution Approach 1:
The patent extracts and eliminates the micro-voids that are inherently created during the sintering process. By using 3D printing to create a substrate with controlled void spaces and then infusing conductive materials into these voids, the method removes the harmful micro-voids while maintaining the benefits of high-melting-point conductive materials.
Solution Approach 2:
The patent utilizes a porous ceramic substrate structure created through 3D printing, where controlled voids are intentionally designed and then filled with conductive materials. This approach transforms the potential weakness of porosity into a strength by using the porous structure as a template for precise conductive material placement, eliminating micro-voids while maintaining structural integrity under vibration and shock.
3Reliability
If 3D-printed ceramic substrates with infused conductive materials are used, then reliability under temperature extremes and mechanical stress is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The patent merges multiple manufacturing steps into an integrated process: 3D printing the ceramic substrate with embedded void patterns, followed by infusion of conductive materials into those voids. This combination of additive manufacturing and infusion processing creates a unified workflow that achieves high reliability while managing complexity through process integration rather than sequential separate operations.
Solution Approach 2:
The patent performs preliminary action by 3D printing the ceramic substrate with pre-designed void spaces before infusing the conductive materials. This preliminary structuring of the substrate with precise void locations and geometries simplifies the subsequent infusion process and ensures reliable conductive material placement, reducing overall manufacturing complexity despite the multi-step process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enables the creation of PCBs with high-melting point ceramics and conductive materials that maintain reliability and functionality from -200°C to 350°C, reducing mechanical stress and signal noise, suitable for high-frequency applications and harsh environments.
Implementation Method 1
3D-printing a ceramic material into a ceramic substrate. The ceramic substrate includes a void.
Implementation Method 2
infusing a material into the void, and retrieving the ceramic substrate with the material within the void. The material is electrically conductive.
Data Source
AI summary
The disclosure provides for methods of making electrically conductive apparatus, such as circuit boards. The methods include 3D-printing a ceramic material into a ceramic substrate that includes a void. A conductive material is infused into the void. The conductive materiel forms electrically conductive connections within the apparatus. Also disclosed are apparatus formed by the methods.