Ceramic PCB Temperature Sensor for Power Distribution Systems
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Solution Overview
Problem
Existing thermal monitoring systems for power distribution systems face challenges in providing reliable and cost-effective temperature readings, with infrared sensors being costly and prone to measurement errors, fiber optic systems being expensive, and RF-powered sensors being sensitive to antenna-sensor arrangements.
Innovation Solution
A temperature sensor using a thermally conductive, electrically insulating ceramic printed circuit board (PCB) with direct contact to measured joints and wired connections for signal transmission, ensuring reliable temperature readings while being cost-friendly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If infrared sensors are used for temperature sensing, then electric breakdown concerns are eliminated, but measurement precision deteriorates due to signal interference and painting requirements
Solution Approach 1:
The patent introduces a thermally conductive, electrically insulating ceramic material as an intermediary between the high-voltage measured joint and the temperature sensing element. This ceramic mediator allows heat transfer while blocking electrical signals, enabling direct thermal contact without electric breakdown risks, thus resolving the contradiction between reliability and measurement precision.
2Reliability
If fiber optics are used to transmit temperature signals, then electric breakdown is avoided, but device complexity and cost increase
Solution Approach 1:
The patent extracts the electrical signal transmission function from the temperature sensing system by using a ceramic material that conducts heat but blocks electrical signals. This eliminates the need for complex fiber optic or wireless transmission systems, reducing device complexity while maintaining electric breakdown prevention.
3Measurement precision
If direct contact thermal sensors are used, then measurement precision improves, but electric breakdown risk increases due to high system voltage
Solution Approach 1:
The patent uses a thermally conductive, electrically insulating ceramic material as an intermediary between the measured joint and the temperature sensing element. This ceramic mediator enables direct thermal contact for accurate measurement while blocking electrical pathways to prevent electric breakdown, thus resolving the contradiction between measurement precision and reliability.
4Ease of operation
If RF powered sensors with antennas are used, then wireless operation is achieved, but device complexity and sensitivity to arrangement increase
Solution Approach 1:
The patent extracts the wireless communication function from the temperature sensing system and replaces it with simple wired connections through the ceramic PCB. This eliminates antennas and RF circuitry, reducing device complexity and eliminating sensitivity to antenna-sensor arrangement while maintaining ease of operation through straightforward wired signal transmission.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The ceramic PCB-based temperature sensor provides reliable temperature monitoring with reduced costs, eliminating concerns related to wireless or RF signal reception and offering robust physical and dielectric strength through the use of epoxy sealing.
Implementation Method 1
The first end of the terminal is configured to be fixed directly in contact with a measured point and the second end of the terminal is directly in touch with the first side of the ceramic PCB such that heat is conducted from the terminal, through the ceramic PCB and then to the temperature sensing element
Implementation Method 2
The temperature sensing element is configured to generate an electrical signal in response to the heat
Implementation Method 3
The temperature sensor further comprises an epoxy to seal a portion of the terminal, the ceramic PCB in its entirety and a portion of the pair of lead wires to ensure a desired physical strength and a desired dielectric strength
Data Source
AI summary
A temperature sensor of a thermal monitoring system is provided for use in power distribution systems. The temperature sensor comprises ceramic printed circuit board (PCB) and a terminal. The ceramic PCB includes a temperature sensing element disposed on a side of the ceramic PCB. The terminal is configured to be fixed directly in contact with a measured point and is directly in touch with the ceramic PCB such that heat is conducted from the terminal, through the ceramic PCB and then to the temperature sensing element. The temperature sensing element is configured to generate an electrical signal in response to the heat such that the electrical signal is sent through a pair of lead wires to a controller for monitoring a temperature. The temperature sensor further comprises an overmolded plastic material to seal a portion of the terminal, the ceramic PCB in its entirety and a portion of the pair of lead wires to ensure a desired physical strength and a desired dielectric strength.