Ceramic PCB Temperature Sensor for Power Distribution Systems
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Solution Overview
Problem
Existing thermal monitoring systems for power distribution systems face challenges in providing reliable and cost-effective temperature sensing, with infrared sensors being user-unfriendly and costly fiber optic or battery-powered solutions requiring maintenance and complex antenna-sensor arrangements.
Innovation Solution
A temperature sensor using a thermally conductive, electrically insulating ceramic material with a direct contact to measured joints and wired connections, featuring a ceramic printed circuit board (PCB) to transmit signals, which is cost-friendly and reliable.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If infrared sensors are used for temperature sensing, then electric breakdown concerns are eliminated, but the measurement precision is reduced and user-friendliness deteriorates due to painting requirements and signal interference
Solution Approach 1:
The patent introduces a thermally conductive, electrically insulating ceramic material as an intermediary between the high-voltage measured joint and the temperature sensing element. This ceramic intermediary allows thermal energy to pass through to the sensor while blocking electrical breakdown, thus resolving the contradiction between reliability and measurement precision by enabling direct contact sensing without electrical interference
Solution Approach 2:
The patent creates a thermal copy of the measured joint's temperature through the ceramic material, allowing the sensing element to detect the temperature of the measured joint indirectly through thermal conduction while maintaining electrical isolation. This copying approach enables accurate temperature measurement without direct electrical contact
2Reliability
If fiber optics are used to transmit temperature signals, then electric breakdown is avoided, but the device complexity and cost increase significantly
Solution Approach 1:
The patent replaces the complex fiber optic transmission system with a simpler wired electrical connection system. By using the thermally conductive ceramic material to enable direct contact sensing, the system can use conventional wired connections for signal transmission, eliminating the need for complex fiber optic infrastructure while maintaining electrical isolation through the ceramic material
Solution Approach 2:
The patent changes the transmission medium from optical signals through fiber optics to electrical signals through wired connections. This parameter change in the signal transmission mode, combined with the ceramic barrier, simplifies the system while maintaining reliability by avoiding the complexity of fiber optic installation and maintenance
3Reliability
If battery-powered wireless sensors are used, then electric breakdown is avoided, but maintenance requirements increase due to battery replacement and wireless connection reliability issues
Solution Approach 1:
The patent enables the sensor to be self-powered through the measured joint itself, which provides electrical power through the terminal contact. This eliminates the need for separate batteries and wireless communication components, allowing the sensor to serve itself without external power sources or complex wireless protocols, thus reducing maintenance requirements
Solution Approach 2:
The patent extracts and eliminates the battery and wireless communication components from the sensor system. By using direct wired connections powered by the measured joint, the design removes the maintenance-intensive elements (batteries requiring replacement and wireless connections requiring alignment), simplifying the system while maintaining electrical isolation through the ceramic material
4Reliability
If RF powered temperature sensors are used, then electric breakdown is avoided, but the device complexity and cost increase due to antenna-sensor arrangements
Solution Approach 1:
The patent replaces the complex RF antenna system with a simple wired electrical connection system. By enabling direct contact sensing through the thermally conductive ceramic material, the system can use conventional electrical wiring for both power and signal transmission, eliminating the need for RF antennas and associated complexity while maintaining electrical isolation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The ceramic PCB-based temperature sensor provides reliable temperature readings while being cost-effective, eliminating concerns related to wireless or RF signal reception and maintenance, and ensuring physical and dielectric strength through epoxy sealing.
Implementation Method 1
The first end of the terminal is configured to be fixed directly in contact with a measured point and the second end of the terminal is directly in touch with the first side of the ceramic PCB such that heat is conducted from the terminal, through the ceramic PCB and then to the temperature sensing element
Implementation Method 2
The temperature sensing element is configured to generate an electrical signal in response to the heat
Data Source
AI summary
A temperature sensor of a thermal monitoring system is provided for use in power distribution systems. The temperature sensor comprises ceramic printed circuit board (PCB) and a terminal. The ceramic PCB includes a temperature sensing element disposed on a side of the ceramic PCB. The terminal is configured to be fixed directly in contact with a measured point and is directly in touch with the ceramic PCB such that heat is conducted from the terminal, through the ceramic PCB and then to the temperature sensing element. The temperature sensing element is configured to generate an electrical signal in response to the heat such that the electrical signal is sent through a pair of lead wires to a controller for monitoring a temperature. The temperature sensor further comprises an epoxy to seal a portion of the terminal, the ceramic PCB in its entirety and a portion of the pair of lead wires to ensure a desired physical strength and a desired dielectric strength.