Multilayer Ceramic Component Pedestal for Impact Resistance
Solution Overview
Problem
Conventional multilayer ceramic electronic components face challenges in achieving high impact resistance, miniaturization, and reliability due to limitations in solder ball size reduction and electrode aspect ratio, leading to insufficient impact resistance and bonding reliability.
Innovation Solution
A multilayer ceramic electronic component is designed with a pedestal portion made of non-metallic inorganic powder and resin, which includes a via hole conductor to enhance mechanical strength and bonding, and a shrinkage-inhibiting layer to suppress shrinkage, allowing for improved impact resistance and miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the diameter of solder balls is decreased to miniaturize the product, then the size is reduced, but the electrode bonding area is decreased and impact resistance becomes insufficient
Solution Approach 1:
The patent introduces a resin layer as an intermediary component between the substrate and semiconductor element. This resin layer acts as a shock-absorbing medium that decouples the mechanical stress transmission path, allowing small solder balls to be used while maintaining impact resistance. The resin layer compensates for the reduced bonding area by providing a larger distributed bonding interface and shock absorption capacity.
Solution Approach 2:
The patent employs a composite structure combining resin material with the ceramic substrate and semiconductor element. The resin layer forms a composite assembly that leverages the strengths of different materials: the rigid ceramic provides structural support, while the compliant resin provides shock absorption, enabling miniaturization without sacrificing impact resistance.
2Volume of moving object
If the thickness of the thermosetting resin layer is decreased to reduce the overall size, then miniaturization is achieved, but the impact resistance becomes insufficient
Solution Approach 1:
The patent optimizes the thickness parameter of the resin layer to achieve a balance between miniaturization and impact resistance. By carefully controlling the resin layer thickness within a specific range, the design achieves sufficient shock absorption while minimizing the overall height. The parameter optimization allows the resin layer to be thin enough for miniaturization but thick enough to maintain impact resistance.
3Volume of moving object
If the diameter of projecting electrodes is decreased and aspect ratio is improved for miniaturization, then the gap between electrodes is reduced, but limits are reached that prevent further reduction
Solution Approach 1:
The resin layer serves as a compensating intermediary that allows for greater flexibility in electrode design. By providing mechanical compliance and stress distribution, the resin layer enables the use of smaller diameter electrodes with higher aspect ratios that would otherwise be too fragile. The resin compensates for the reduced mechanical strength of thin electrodes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a multilayer ceramic electronic component with enhanced impact resistance, reduced size, high dimensional precision, and reliability by securely bonding the surface mounting-type electronic component through the pedestal portion, preventing impact transmission and maintaining bonding reliability.
Implementation Method 1
a pedestal portion provided on a region of a first main surface of the multilayer ceramic body and including a non-metallic inorganic powder and a resin so that the pedestal portion is fixed to the first main surface with at least the resin
Implementation Method 2
a shrinkage-inhibiting layer arranged to suppress shrinkage in the planar direction of the ceramic base material layer
Implementation Method 3
a via hole conductor provided in the pedestal portion so that one of the end surfaces is exposed in a surface of the pedestal portion
Data Source
AI summary
In a multilayer ceramic electronic component, a pedestal portion is provided on a region of a first main surface of a multilayer ceramic body and includes a non-metallic inorganic powder and a resin so that the pedestal portion is fixed to the first main surface with at least the resin, the multilayer ceramic body being formed by stacking a ceramic base material layer and a shrinkage-inhibiting layer having a predetermined conductor pattern. Also, a via hole conductor is disposed in the pedestal portion so that one of the end surfaces is exposed in a surface of the pedestal portion, and a surface mounting-type electronic component such as a semiconductor element is connected, through a conductive binder, to the one of the end surfaces of the via hole conductor exposed in the surface of the pedestal portion. A resin is provided between the surface mounting-type electronic component and the pedestal portion, the resin having the same composition as in the resin of the pedestal portion. A semiconductor element is mounted as the surface mounting-type electronic component on the pedestal portion.