Ceramic Phosphor Tile Thermal Dissipation via Metal Coating

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Solution Overview

Problem

High-power density light sources face challenges with heat management, as existing thermal management solutions, such as silicone adhesives and metal layers like aluminum and silver, degrade or introduce thermal resistance, making it costly to achieve efficient thermal dissipation in high-intensity applications like projection and automotive lighting.

Innovation Solution

A luminescent assembly comprising a ceramic luminescent body with a thermally conductive element and a coating layer, where the thermally conductive element is made of supersonic particle deposited metal material, providing effective thermal dissipation and conformal shape adaptation, and the coating layer enhances thermal contact and reflectivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If silicone adhesive is used to provide thermal contact between heat sink and ceramic phosphor, then thermal contact is improved, but at high intensities silicone degrades

Engineering Contradiction:

Improvethermal contactVSAvoidmaterial degradation

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent replaces the degradable silicone adhesive with a direct bonding approach using metal layers (aluminum or silver) that can be soldered to the heat sink. This eliminates the need for organic adhesives that degrade at high temperatures, using instead inorganic materials that maintain thermal contact reliability under high-intensity conditions.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The patent introduces metal layers (aluminum or silver) as intermediary bonding layers between the ceramic phosphor and heat sink. These layers serve dual purposes: providing thermal conduction pathways and enabling solderable connections, thereby mediating the thermal interface without relying on degradable organic materials.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Illumination intensity

If aluminum or silver layers are deposited on ceramic phosphor for high reflectivity, then reflectivity is improved, but solderability is reduced

Engineering Contradiction:

ImprovereflectivityVSAvoidsolderability

Core Design Contradiction:

Illumination intensityVSEase of manufacture

Solution Approach 1:

The patent segments the bonding interface into multiple functional layers: a reflective layer (aluminum or silver) for optical performance and a separate solderable metal layer (such as nickel) for mechanical bonding. This segmentation allows each layer to optimize its specific function without compromising the other.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent creates a composite structure with multiple metal layers deposited on the ceramic phosphor. The composite comprises a reflective layer for optical properties and a solderable layer for manufacturing ease, combining the advantages of both material types in a single integrated structure.

Inventive Principle:

Principle #40Composite materials

3Ease of manufacture

If multi layers are deposited on ceramic phosphor to make it solderable, then solderability is improved, but thermal resistance increases and cost increases

Engineering Contradiction:

ImprovesolderabilityVSAvoidthermal resistance

Core Design Contradiction:

Ease of manufactureVSTemperature

Solution Approach 1:

The patent optimizes the thickness and material composition of the metal layers to balance solderability and thermal conduction. By controlling the parameters of the deposited layers (such as using thin nickel layers for solderability while maintaining good thermal contact), the patent achieves manufacturability without introducing excessive thermal resistance.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The assembly enables efficient thermal management and high-intensity radiation, maintaining brightness while reducing thermal resistance and costs, by ensuring good thermal contact and conformal fit between the luminescent body and the thermally conductive element.

Implementation Method 1

the thermally conductive element comprises metal material... at least 25% of the external surface is in thermal contact with the thermally conductive element

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

the thermally conductive element comprises supersonic particle deposited metal material... This may allow a conformal shape

Methodology Applied

Scientific EffectParticle deposition: Deposition (physical)

Data Source

PatentEP4165143B1Embedded phosphor ceramic tile

Publication Date: 2023.10.25 SIGNIFY HOLDING BV

Figure 1A(I)~1B(II)
Figure 2A(I)~2A(IV)
Figure 2B(I)~2B(V)

AI summary

The invention provides an assembly (2000) comprising a luminescent body (200), a thermally conductive element (400), and a coating layer (500), wherein: - the luminescent body (200) comprises a luminescent material (210), wherein the luminescent body (200) comprises a ceramic luminescent body, and wherein the luminescent body (200) comprises an external surface (220); - the thermally conductive element (400) comprises metal material (410); - at least 25% of the external surface (220) is in thermal contact with the thermally conductive element (400); and - the coating layer (500) is configured between the luminescent body (200) and the thermally conductive element (400).