Ceramic Plastic Composite Nanohole Adhesion Method
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Solution Overview
Problem
Existing methods for combining ceramic and plastic structures in 3C electronic products face challenges such as poor adhesion, brittleness, and increased fabrication costs, leading to instability and high costs in structural components.
Innovation Solution
A method involving chemical cleaning, microetching, and hole reaming treatments on ceramic matrices to create nanoholes with diameters between 150 nm and 450 nm, followed by injecting plastics to form a plastic layer that deeply fills these nanoholes, enhancing adhesion and air tightness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If adhesive is used to fix plastic member to ceramic component, then assembly is simple, but adhesion strength is poor and plastic member easily drops off
Solution Approach 1:
The invention creates nanoholes (150-450 nm diameter) on the ceramic surface through chemical etching and hole reaming treatments. These nanoholes allow plastic material to penetrate deeply into the ceramic surface, forming a mechanical interlocking structure that dramatically improves adhesion strength while maintaining assembly simplicity.
Solution Approach 2:
The invention creates a composite structure where plastic material fills and bonds with the nanoholed ceramic surface. This composite interface combines the strength of ceramic with the adhesion properties of plastic, achieving both high strength and ease of manufacture.
2Strength
If engaging components such as buckles or indents are used to combine ceramic and plastic members, then combined strength is improved, but fabrication cost greatly increases
Solution Approach 1:
The nanoholed ceramic surface provides a porous structure that enables direct bonding with plastic material without requiring additional engaging components. This eliminates the need for buckles or indents, achieving high combined strength while reducing fabrication cost.
Solution Approach 2:
The invention extracts the function of engaging components by creating nanoholes that provide mechanical interlocking directly on the ceramic surface. This eliminates the need for separate buckles or indents, reducing part count and fabrication cost while maintaining combined strength.
3Reliability
If conventional ceramic structures are used, then durability and air tightness are good, but weight is high and thickness is large
Solution Approach 1:
The invention creates a ceramic-plastic composite structure where plastic material fills the nanoholes on the ceramic surface. This composite structure reduces weight and thickness compared to solid ceramic, while the nanohole interlocking mechanism maintains durability and air tightness.
Solution Approach 2:
The invention applies plastic material locally in the nanoholes on the ceramic surface, creating a hybrid structure that combines the advantages of both materials. The ceramic provides durability and air tightness, while the plastic reduces weight and thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method significantly improves the combined strength and air tightness between ceramic and plastic layers, achieving a reliable and cost-effective composite with enhanced performance and reduced thickness, suitable for lightweight, high-performance electronic products.
Implementation Method 1
performing a chemical cleaning treatment on a surface of a ceramic matrix
Implementation Method 2
performing a microetching treatment on the surface of the ceramic matrix after the activation treatment, so as to form a plurality of microholes
Implementation Method 3
performing a hole reaming treatment on the surface of the ceramic matrix after the microetching treatment, so as to enlarge an average diameter of the plurality of microholes, thereby forming a plurality of nanoholes
Implementation Method 4
performing a surface activating treatment on the surface of the ceramic matrix after the hole reaming treatment
Implementation Method 5
injecting plastics onto the surface of the ceramic matrix after the baking process to form a plastic layer and combining the plastic layer with the surface of the ceramic matrix through the plurality of nanoholes
Implementation Method 6
The plastic layer more deeply fills the nanoholes to have higher adhesion
Data Source
AI summary
A ceramic and plastic composite and a method for fabricating the same are disclosed. A chemical cleaning treatment, a microetching treatment, a hole reaming treatment, and a surface activating treatment are performed on the surface of a ceramic matrix to form nanoholes with an average diameter ranging between 150 nm and 450 nm. Plastics are injected onto the surface of the baked ceramic matrix to form a plastic layer. The plastic layer more deeply fills the nanoholes to have higher adhesion. Thus, the higher combined strength and air tightness exist between the ceramic matrix and the plastic layer to improve the reliability and the using performance of the ceramic and plastic composite.