Ceramic Wafer Support Plug Structure for Plasma Discharge Suppression
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Solution Overview
Problem
Existing semiconductor manufacturing equipment members experience significant electrical discharges during high-power plasma processing, necessitating improved discharge suppression techniques.
Innovation Solution
A member for semiconductor manufacturing equipment featuring a ceramic substrate with embedded plugs composed of a dense body and reinforced gas passages, divided by ribs to enhance discharge suppression and prevent chipping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a gas passage portion vertically penetrates the ceramic substrate without a plug, then gas flow is unobstructed, but electrical discharge occurs between the wafer and base plate
Solution Approach 1:
The patent employs a porous plug material that allows gas to pass through while providing electrical insulation. The porous structure enables gas flow functionality while the material's inherent porosity provides the necessary electrical insulation properties to prevent discharge between the wafer and base plate.
Solution Approach 2:
The invention uses composite material construction for the plug, combining materials with different properties to achieve both gas permeability and electrical insulation. This composite approach allows the plug to simultaneously fulfill multiple functional requirements that cannot be met by a single material.
2Productivity
If the upper end opening of the gas passage is made large, then gas flow rate is improved, but the opening becomes susceptible to chipping
Solution Approach 1:
The patent divides the large upper end opening into multiple smaller openings using partition walls. This segmentation maintains the overall gas flow rate by providing multiple pathways while reducing the size of individual openings, thereby minimizing their susceptibility to chipping and improving structural integrity.
Solution Approach 2:
The invention introduces a vertical dimension by creating partition walls that extend downward from the upper end opening. This dimensional approach allows the opening to be divided into segments without reducing the overall cross-sectional area available for gas flow, thus maintaining productivity while improving strength.
3Reliability
If multiple partitions are added to divide the gas passage opening, then discharge suppression is enhanced, but manufacturing complexity increases
Solution Approach 1:
The patent optimizes the number, size, and arrangement of partition walls as controllable parameters to achieve effective discharge suppression while maintaining manufacturability. By carefully selecting parameters such as partition thickness, spacing, and height, the design balances performance requirements with manufacturing capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces electrical discharges and chipping, ensuring stable wafer processing by optimizing gas flow and structural integrity.
Implementation Method 1
a large potential difference from the wafer may occur, and discharge (insulation breakdown) may occur between the wafer and the base plate via the gas passage portion... if there is a plug, it suppresses the discharge because the electrons hit the plug before colliding with other gas molecules
Implementation Method 2
Plugs are often composed of porous materials... at least a portion of the entire length of the gas flow passage section be made porous and insulating
Implementation Method 3
the upper end opening is provided with a reinforcing rib that prevents chipping of the opening
Data Source
AI summary
A member for a semiconductor manufacturing equipment includes: a ceramic substrate having an upper surface on which a wafer is to be placed, and a lower surface; a plug placement hole that vertically penetrates the ceramic substrate; and a plug embedded in the plug placement hole; wherein the plug is composed of a dense body and has an upper end surface exposed on a side of the upper surface, a lower end surface exposed on a side of the lower surface, and a gas passage extending from an upper end opening provided on the upper end surface, through an inside of the dense body, to a lower end opening provided on the lower end surface, and wherein the gas passage is provided with a reinforcing rib that divides the upper end opening into a plurality of segments.