Ceramic Pressure Sensor Base Metallized Layer Insulation

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Solution Overview

Problem

Existing pressure sensors with semiconductor type pressure detection devices face issues with increased manufacturing man-hours due to additional components and potential decreases in detection accuracy from high voltage exposure and thermal expansion, particularly when using metal-based components.

Innovation Solution

A pressure detection unit with a ceramic-based base, integrated with a metallized layer and brazing portions, and a diaphragm-ring structure, which eliminates the need for additional discharging plates and enhances insulation, reducing weight and thermal expansion impacts.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a metal-based base is used in the pressure detection unit, then electrical conductivity and heat dissipation are improved, but detection accuracy decreases due to high voltage exposure and thermal expansion

Engineering Contradiction:
Improveelectrical conductivityVSAvoiddetection accuracy
Core Design Contradiction:
ReliabilityVSMeasurement precision

Solution Approach 1:

The base is constructed using composite materials, specifically a ceramic substrate with metallized layers. The ceramic portion provides electrical insulation and thermal stability to maintain detection accuracy, while the metallized layers (such as aluminum or copper) provide the necessary electrical conductivity and heat dissipation. This composite structure resolves the contradiction by combining materials with complementary properties.

Inventive Principle:
Principle #40Composite materials

2Reliability

If additional discharging plates are added to the pressure detection unit, then static charge accumulation is reduced, but manufacturing complexity and production time increase

Engineering Contradiction:
Improvestatic charge controlVSAvoidmanufacturing complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The discharging function is merged into the base structure itself. The base includes a discharging plate integrated with its structure, and the metallized layers on the ceramic base also serve as discharge paths. This integration eliminates the need for separate, additional discharging plates, thereby reducing manufacturing complexity while maintaining static charge control functionality.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The base structure performs multiple functions simultaneously: it provides mechanical support, electrical insulation, heat dissipation, and static charge discharge. The metallized layers serve both as electrical connection paths and as discharge electrodes, reducing the need for separate components and simplifying the overall device structure.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Reliability

If more components are added to ensure insulation and discharge functionality, then detection reliability is improved, but weight and device complexity increase

Engineering Contradiction:
Improveinsulation reliabilityVSAvoiddevice weight
Core Design Contradiction:
ReliabilityVSWeight of moving object

Solution Approach 1:

The ceramic base with metallized layers provides both insulation and electrical connectivity in a single integrated component, eliminating the need for separate insulating plates and discharge electrodes. This composite structure achieves the required insulation reliability while minimizing weight compared to using multiple separate metal and insulating components.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively suppresses manufacturing complexity, ensures insulation, and maintains detection accuracy by using a ceramic base with metallized layers and brazing, reducing the impact of thermal changes and high voltage exposure.

Implementation Method 1

a metal layer 180 obtained by performing a metallization process on a metal material on a surface of a ceramic material is formed in a region enclosing the semiconductor type pressure detection device 150 on a surface on the pressure receiving space S1 side in the inner portion 114 of the base 110

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

one ends of a plurality of terminal pins 160, 162, 164, and 166 are joined and fixed to the base 110 by forming a brazing portion B1

Methodology Applied
Scientific EffectBrazing: Brazing

Implementation Method 3

a ceramic material having an insulating property in which an outer circumferential portion 112 and an inner portion 114 having a smaller thickness than that of the outer circumferential portion 112 are integrated with each other

Methodology Applied
Scientific EffectThermal insulation: Thermal Insulation

Data Source

PatentEP3208588B1Pressure detection unit and pressure sensor using the same
Publication Date: 2019.04.10 FUJIKOKI CORP
  • EP3208588B1 patent drawingFigure 1A~1B
  • EP3208588B1 patent drawingFigure 2
  • EP3208588B1 patent drawingFigure 3A~3B

AI summary

[Object] Provided are a pressure detection unit and a pressure sensor using the same capable of suppressing an increase in manufacturing manhours due to use of an additional member, and ensuring insulation of a semiconductor type pressure detection device. [Solving Means] A pressure detection unit includes a base formed in a lid shape and made of ceramic, a receiving member formed in a plate shape, a diaphragm interposed between the base and the receiving member, a semiconductor type pressure detection device installed on a side of a pressure receiving space formed between the base and the diaphragm in the base, and terminal pins electrically connected to the semiconductor type pressure detection device, the terminal pins penetrating the base, wherein a metal layer is provided in a region around the semiconductor type pressure detection device on a surface of the base on the side of the pressure receiving space.