Ceramic Puck Bonding Layout for Uniform Electrostatic Chuck Heating
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Solution Overview
Problem
Substrate support assemblies, such as electrostatic chucks, often exhibit non-uniform temperature profiles due to variations in heating elements, RF elements, and material density, which can impact the material properties of substrates being processed.
Innovation Solution
A method involving temporarily clamping a ceramic puck plate to a cooling plate with bonding material, heating the puck plate to a target temperature, recording temperatures across the substrate support surface, and modifying the bonding material's properties to achieve a uniform temperature profile.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional bonding material is used between ceramic puck plate and cooling plate, then assembly is simple, but temperature profile is non-uniform
Solution Approach 1:
The bonding material structure is modified locally by creating perforations at specific locations where temperature uniformity needs improvement. These perforations are strategically positioned to address local thermal non-uniformities rather than uniformly modifying the entire bonding material structure.
Solution Approach 2:
The bonding material is transformed into a porous structure by introducing perforations. This porous configuration modifies thermal conduction paths, allowing for better temperature distribution across the substrate support surface by reducing thermal resistance in specific areas.
2Temperature
If bonding material thickness is increased, then thermal insulation improves, but temperature uniformity deteriorates
Solution Approach 1:
The bonding material layer is segmented by introducing perforations that divide the continuous material into separate regions. This segmentation creates multiple thermal pathways and reduces the effective thermal mass, improving temperature uniformity without requiring overall thickness reduction.
Solution Approach 2:
Instead of uniformly reducing thickness in one dimension, the solution introduces vertical perforations that modify thermal properties in the thickness direction while maintaining the overall bonding material dimensions. This dimensional approach allows thermal management without compromising structural integrity.
3Productivity
If heating elements and RF elements are used, then substrate processing capability is improved, but temperature non-uniformity is introduced
Solution Approach 1:
The patent employs temperature sensing elements that provide feedback on the actual temperature distribution across the substrate support surface. This feedback information is used to adjust heating and RF power distribution, compensating for non-uniformities introduced by these elements.
Solution Approach 2:
The system dynamically adjusts operational parameters including heating power, RF power, and cooling flow rates based on measured temperature distributions. These parameter changes enable real-time compensation for temperature non-uniformities while maintaining substrate processing capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves a uniform temperature profile across the substrate support surface with less than 1°C variation, improving the thermal uniformity and reducing the impact on substrate material properties.
Implementation Method 1
one or more layers of bonding material between the ceramic puck and the cooling plate
Implementation Method 2
perforations that reduce a thermal conductivity of the one or more layers of the engineered bonding material
Data Source
AI summary
Methods for improving thermal uniformity on a surface of a substrate support assembly. One method includes temporarily clamping a ceramic puck plate to a cooling plate of a substrate support assembly with one or more layers of bonding material between the ceramic puck and the cooling plate. The method further includes heating the ceramic puck plate to a target temperature, cooling the cooling plate to an operating temperature, and recording temperatures at a plurality of locations on a substrate support surface of the ceramic puck plate. The method further includes modifying, based on the recorded temperatures, one or more properties of the one or more layers of the bonding material to achieve a target temperature profile on the substrate support surface.