Ceramic Solid-State Relay Structure for High-Temperature Heat Dissipation
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Solution Overview
Problem
Existing solid-state relays face issues with heat accumulation leading to operational instability due to the need for multiple heat sink models that are not environment-specific, affecting their performance in various conditions.
Innovation Solution
A high-temperature resistant solid-state relay design featuring a bottom board made of aluminum and a heat dissipation rack, frame body, PCB, and top cover made of ceramic materials, with a carbonized MOS field-effect transistor and epoxy resin, allowing for internal heat dissipation and continuous operation without a heat sink.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional solid-state relay design is used with standard heat sinks, then heat dissipation is achieved, but the relay cannot adapt to different environmental conditions and requires multiple heat sink models
Solution Approach 1:
The patent applies universality by designing a heat dissipation structure where the frame body and bottom board serve dual functions: structural support and heat dissipation. The ceramic material in the frame body and aluminum alloy bottom board create a universal heat dissipation path that adapts to different environments without requiring multiple specialized heat sink models.
Solution Approach 2:
The patent merges the heat dissipation function with the structural components (frame body and bottom board). The heat dissipation rack is integrated into the bottom board, and the ceramic frame body itself acts as a heat dissipation component, eliminating the need for separate external heat sinks in many applications.
2Reliability
If heat sinks are used for heat dissipation, then operating temperature is controlled, but the relay requires external components and cannot operate without them
Solution Approach 1:
The patent implements self-service by making the relay's own structural components (frame body and bottom board) responsible for heat dissipation. The ceramic frame body and aluminum alloy bottom board with integrated heat dissipation rack create a self-contained heat management system that does not require external heat sinks, allowing the relay to maintain reliable operation independently.
3Adaptability or versatility
If multiple heat sink models are maintained for different environments, then heat dissipation effectiveness is improved, but storage and selection complexity increases
Solution Approach 1:
The patent eliminates the need to stock multiple heat sink models by creating a universal heat dissipation structure. The frame body with ceramic material and the aluminum alloy bottom board with heat dissipation rack provide effective heat dissipation across different environments, reducing inventory requirements to just one standardized design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design maintains stable operation by effectively dissipating heat through ceramic components and aluminum bottom boards, ensuring the relay's functionality even at high temperatures, eliminating the need for environment-specific heat sinks.
Implementation Method 1
a bottom board, a switch component, a Printed Circuit Board (PCB), a frame body for protecting the PCB, and a top cover... The bottom board is made of aluminum and the heat dissipation rack, frame body, PCB and top cover are made of ceramic materials
Implementation Method 2
The accumulated heat will also affect the operating performance of the solid-state relay. Therefore, the solid-state relay is generally used in cooperation with the heat sink
Data Source
AI summary
Provided is a high-temperature resistant solid-state relay including a bottom board, a switch component, a PCB, a frame body, a top cover and a heat dissipation rack fixed with the bottom board. An upper surface of the bottom board is fixed with the switch component; the frame body is fixed with the bottom board; the PCB is embedded in the frame body; and the switch component is connected with the PCB. The PCB is provided with a large output copper column, a large input copper column, a small output control signal copper column and a small input control signal copper column. The top cover is located above the frame body. The bottom board is made of a first high-temperature resistant material; the heat dissipation rack, the frame body, the PCB and the top cover are made of a second high-temperature resistant material.