Standardized Ceramic Base Plate with Interchangeable Resin Socket
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Solution Overview
Problem
The high cost and complexity of manufacturing customized ceramic base plates for various integrated circuits make existing electrical connecting apparatuses expensive and inefficient.
Innovation Solution
A standardized ceramic base plate design with interchangeable resin and wiring components, allowing for bulk production of ceramic base plates and customized resin layers for different integrated circuits, facilitated by a socket device that simplifies attachment and detachment of pins, reducing the need for extensive wiring on the ceramic base plate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If customized ceramic base plates are manufactured for each type of integrated circuit, then the electrical connecting apparatus can be adapted to different devices, but the manufacturing cost and complexity increase significantly
Solution Approach 1:
The electrical connecting apparatus is divided into modular components: a standardized ceramic base plate and interchangeable resin base plates. Each resin base plate is customized for specific integrated circuit types, while the ceramic base plate remains uniform. This segmentation allows the ceramic base plate to be manufactured once in standard form, reducing its manufacturing complexity, while still achieving adaptability through the interchangeable resin components.
Solution Approach 2:
The ceramic base plate is designed with universal functionality to work with multiple types of integrated circuits through the interchangeable resin base plates. The standardized conductive portions and socket device on the ceramic base plate can accommodate different resin base plate configurations, making the ceramic base plate itself universal rather than customized for each application.
2Adaptability or versatility
If customized ceramic base plates are manufactured for each type of integrated circuit, then the electrical connecting apparatus can be adapted to different devices, but the manufacturing cost increases
Solution Approach 1:
The system segments the customization requirement from the ceramic base plate to the resin base plate. The ceramic base plate is manufactured as a standardized component once, while the resin base plates are customized for different integrated circuit types. This segmentation eliminates the need for expensive customized ceramic base plates for each application, significantly reducing manufacturing costs.
Solution Approach 2:
The resin base plates can be removed and replaced depending on the integrated circuit type being tested. This allows the expensive standardized ceramic base plate to be reused multiple times with different resin base plates, amortizing its manufacturing cost over many uses, thereby reducing the overall cost per test application.
3Adaptability or versatility
If extensive wiring is formed on the ceramic base plate for each integrated circuit type, then electrical connections can be customized, but the production time increases
Solution Approach 1:
The wiring and electrical connection customization is segmented from the ceramic base plate to the resin base plate. The ceramic base plate has standardized conductive portions without extensive customized wiring, while the resin base plates contain the customized wiring patterns specific to each integrated circuit type. This allows rapid production of standardized ceramic base plates while customization is achieved through interchangeable resin components.
Solution Approach 2:
The resin base plates are pre-configured with customized wiring patterns and contacts specific to different integrated circuit types before being attached to the standardized ceramic base plate. This preliminary customization of the resin base plates allows the ceramic base plate to be produced quickly in standard form, and the customized electrical connections are achieved by attaching the pre-prepared resin base plates rather than creating custom wiring on each ceramic base plate.
Data Source
AI summary
In the electrical connecting apparatus, a plurality of pins on a ceramic base plate so as to project from one face of the ceramic base plate, a resin base plate including a plurality of conductive portions electrically connected to those pins on the other face of the ceramic base plate and a plurality of recesses opening on the side of the ceramic base plate in the socket device so as to receive pins individually are disposed, and a plurality of pairs of holding members for releaseably holding the pins received in the recesses are provided, thereby coupling the ceramic base plate with the socket device and coupling the socket device with the wiring base plate.