Ceramic-Resin Composite Body Thermal Conductivity Adhesion
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Solution Overview
Problem
Existing thermally conductive insulating adhesive sheets face limitations in heat dissipation due to the presence of adhesive layers with low thermal conductivity, which increases thermal resistance and complicates the manufacturing process, especially when laminating ceramic-resin composite bodies or bonding them to electronic members.
Innovation Solution
A ceramic-resin composite body comprising 35% to 70% non-oxide ceramic sintered bodies with specific particle sizes and aspect ratios, combined with a thermosetting resin composition having a high exothermic onset temperature, curing rate, and molecular weight, which infiltrates irregularities on electronic members for enhanced thermal conductivity and adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive layers are used between ceramic-resin composite bodies or between the composite body and electronic members, then bonding is achieved, but thermal conductivity decreases due to low thermal conductivity of the adhesive layers
Solution Approach 1:
The invention extracts and eliminates the adhesive layer from the system by enabling the thermosetting resin composition itself to serve as both the bonding agent and the thermally conductive material. The resin composition is formulated to provide both adhesion to electronic members and high thermal conductivity, thereby removing the separate adhesive layer that was causing thermal resistance.
Solution Approach 2:
The thermosetting resin composition is designed to perform multiple functions simultaneously: it acts as the matrix material for the ceramic-resin composite, provides thermal conduction pathway, and serves as the adhesive bonding agent. This multi-functionality eliminates the need for separate adhesive layers and reduces thermal resistance in the overall structure.
2Reliability
If ceramic powder is highly filled in the thermosetting resin, then thermal conductivity increases, but the resin becomes too rigid and cannot infiltrate irregularities on electronic member surfaces
Solution Approach 1:
The invention changes the particle size parameter of the ceramic filler to sub-micron levels (0.1-10 μm), which fundamentally alters the rheological properties of the resin composition. The fine particle size reduces viscosity and increases flowability, enabling the highly filled resin to infiltrate surface irregularities while maintaining high ceramic content for thermal conductivity.
Solution Approach 2:
The invention uses ceramic particles with a broad size distribution (0.1-10 μm range) where finer particles fill voids and irregularities on electronic member surfaces, while larger particles provide the main thermal conduction pathways. This local differentiation of particle functions optimizes both infiltration ability and thermal conductivity.
3Reliability
If particle size of ceramic powder is increased, then thermal conductivity improves, but adhesion to electronic members decreases
Solution Approach 1:
The invention employs a distributed particle size approach where fine particles (0.1-10 μm) concentrate at the interface with electronic members to provide adhesion, while larger particles form the bulk thermal conduction network. This spatial differentiation resolves the contradiction between particle size, thermal conductivity, and adhesion.
4Ease of operation
If thermosetting resin is used in uncured state for coating, then simple operation is achieved, but the resin layer has low thermal conductivity before curing
Solution Approach 1:
The invention changes the thermal conductivity parameter of the thermosetting resin by incorporating high thermal conductivity ceramic particles (alumina, aluminum nitride, boron nitride) in sub-micron sizes. This creates a percolation network within the resin that provides significant thermal conductivity even in the uncured state, while the resin maintains its fluidity for simple coating operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves unprecedented high thermal conductivity, improved insulation, and adhesiveness, enabling efficient heat dissipation and reliable bonding while simplifying the manufacturing process, thus addressing the limitations of previous technologies.
Implementation Method 1
heating the sheet to melt the thermosetting resin in the semi-cured state (B stage) and infiltrating the molten resin into irregularities on the surface of the electronic member
Implementation Method 2
a sintered body having a monolithic structure in which non-oxide ceramic primary particles having an average major diameter of from 3 to 60 μm and an aspect ratio of from 5 to 30 are three-dimensionally continuous
Implementation Method 3
a thermosetting resin composition having an exothermic onset temperature of 180 °C or more and a curing rate of from 5% to 60%
Data Source
AI summary
Provided is a ceramic-resin composite body that has good mass productivity and product properties (heat dissipation properties, insulation properties and adhesive properties), and particularly a ceramic-resin composite that can dramatically improve the heat dissipation properties for electronic devices. The ceramic-resin composite body includes: 35 to 70% by volume of a sintered body having a monolithic structure in which non-oxide ceramic primary particles having an average major diameter of from 3 to 60 µm and an aspect ratio of from 5 to 30 are three-dimensionally continuous; and 65 to 30% by volume of a thermosetting resin composition having an exothermic onset temperature of 180 °C or more and a curing rate of from 5 to 60% as determined with a differential scanning calorimeter, and having a number average molecular weight of from 450 to 4800, wherein the sintered body is impregnated with the thermosetting resin composition.