Multilayer Ceramic Component Conductive Resin Layer Void Control
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Solution Overview
Problem
Multilayer ceramic electronic components face instability in fail-safe functions due to variability in fracture passage and fragility, leading to cracking under substrate bending stress, especially in harsh environments.
Innovation Solution
A multilayer ceramic electronic component design featuring a conductive resin layer with specific void volume ratios and layer dimensions, where the first and third layers have void volumes of 10 vol% or less, and the second layer has void volumes of 16 vol% or more, to control crack development and stabilize the fail-safe function.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a thermosetting resin layer is formed to completely cover the baked electrode layer, then stress release function is provided, but fracture crack development becomes unstable and may bend toward the capacitor body
Solution Approach 1:
The conductive resin layer is divided into multiple layers (first conductive resin layer, second conductive resin layer, third conductive resin layer) with different void volumes. This segmentation allows each layer to have different mechanical properties, preventing unstable crack propagation while maintaining stress release function.
Solution Approach 2:
Different regions of the conductive resin layer have different void volumes tailored to their specific functions: the first and third layers have lower void volumes (10 vol% or less) for stability and adhesion, while the second layer has higher void volume (16 vol% or more) for controlled fracture initiation, ensuring cracks stay within the resin layer.
2Strength
If the conductive resin layer has high void volume to reduce stress concentration, then crack resistance improves, but structural integrity and conductivity may deteriorate
Solution Approach 1:
The void volume parameter is precisely controlled within specific ranges (10 vol% or less for first and third layers, 16 vol% or more for second layer) to optimize the balance between stress concentration reduction and structural integrity, preventing both crack initiation and excessive deformation.
Solution Approach 2:
The conductive resin layer is formed as a composite material containing conductive particles dispersed in a resin matrix with controlled void distribution. This composite structure provides both mechanical strength and electrical conductivity while managing stress concentration through the void architecture.
Data Source
AI summary
A multilayer ceramic electronic component includes a laminated body. External electrodes are provided on both end surfaces of the laminated body. The external electrodes include a base electrode layer, a conductive resin layer disposed on the base electrode layer, and a plating layer disposed on the conductive resin layer. The conductive resin layer includes a first layer located on the base electrode layer, a second layer located on the first layer, and a third layer located on the second layer. A void volume of the first layer and the third layer calculated by a predetermined equation is about 10 vol % or less, and a void volume of the second layer is about 16 vol % or more, and thicknesses of the first layer, the second layer, and the third layer satisfy predetermined conditions.